Indium Corporation Experts to Present at ICEET


Reading time ( words)

Indium.jpgIndium Corporation experts will share their knowledge at the International Conference for Electronics Enabling Technologies (ICEET), June 4-6, Markham, Ontario.

From left to right: Ed Briggs, Northeast regional sales manager; Dr. Jie Geng, Research Metallurgist; and Dr. HongWen Zhang, manager, R&D Alloy Group.

Ed Briggs, Northeast Regional Sales Manager, will present Electrical Reliability for Automotive Assembly. He will discuss how the increasing amount of electronics in vehicles has escalated demands on automotive electrical systems in an industry with already challenging requirements. Briggs will also detail how Indium8.9HF Solder Paste provides improved electrical reliability and exceeds automotive requirements for SIR, electrochemical migration, and other harsh electrical requirements.

LED packaging has evolved from simple low-power packaging and gained many more applications in various industries. LEDs are now subject to challenges such as wide temperature ranges, high electrical currents, creep, and vibrations. Dr. Jie Geng, Research Metallurgist, will present High-Reliability Lead-Free Solder Alloys for High-Brightness LED Applications. In this presentation, he will examine the development of a novel high-reliability SnAgCuSb-based lead-free solder alloy designed to meet these challenges.

Power modules have continued to move toward higher power density, which requires die-attach materials to maintain long-term joint integrity in harsh high-temperature environments. Under temperatures >175°C, joint reliability can be jeopardized by defects driven by thermal or electromigration. Dr. HongWen Zhang, Manager, R&D Alloy Group, will present Microstructural Evolution of Solder Joints Under High-Temperature Service. His presentation examines the results of a die-attach materials test using four-lead free solders designed to examine the microstructural evolution of solder joints.

Briggs is an SMTA-certified process engineer. He earned his associate degree in chemical technology from Mohawk Valley Community College, where he received the Douglas J. Bauer Award for Excellence in Chemistry. In addition, he earned his Six Sigma Green Belt from Dartmouth College. Briggs joined Indium Corporation in 1990 and has held a variety of positions in production and technical support.

Dr. Geng has extensive experience on materials selection, design, processing, and characterization, especially on processing-structure-property relationships in various materials including ultra-high temperature alloys, lightweight alloys (Al and Mg), magnetic materials, and ceramics. He received his PhD in Metallurgy from the University of Surrey in the U.K. and has published more than 20 journal articles in the field of materials science and engineering. Dr. Geng also serves as a peer reviewer for numerous journals.

Dr. Zhang has extensive experiences in various aluminum (Al) alloys and fiber/particle-reinforced Al-based composite materials, and Al-rich and ZrHf-based amorphous alloys. He has published 20 or so journal publications in the field of metallurgy, materials science and engineering, physics, and mechanics. He was also invited as a peer reviewer for numerous journals. Dr. Zhang has a Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College. He is also a certified IPC Specialist for IPC-A-600 and IPC-A-610D.

To view papers authored by Indium Corporation experts, visit www.indium.com/techlibrary.

About Indium Corporation

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

Share

Print


Suggested Items

Advancement of SPI Tools to Support Industry 4.0 and Package Scaling

08/06/2019 | A. Prasad, L. Pymento, S.R. Aravamudhan, and C. Periasamy, Intel Corp.
This paper evaluates the current state of inline SPI tools from multiple vendors for solder paste measurement accuracy and capability. It discusses a measurement capability analysis that was carried out against a golden metrology tool across a range of volume deposits, and highlights the results from the study.

Practical Implementation of Assembly Processes for Low Melting Point Solder Pastes (Part 2)

07/24/2019 | Adam Murling, Miloš Lazić, and Don Wood, Indium Corporation; and Martin Anselm, Rochester Institute of Technology
In the last three to five years, there has been a resurgence of interest in the use of low melting point alloys for SMT applications. Typically, the compositions are around the eutectic bismuth-tin alloy, perhaps with additions of other elements to increase the robustness of certain alloy properties. Now, there are several new products on the market and numerous ongoing reliability projects in industry consortia.

The Four Things You Need to Know About Test

07/24/2019 | Neil Sharp, JJS Manufacturing
The electronics manufacturing process can often be extremely complex, and the costs associated with product recalls can be astronomical. A robust approach to test is key to ensuring the quality of your product and the satisfaction of your end user.



Copyright © 2019 I-Connect007. All rights reserved.