MacDermid Alpha to Present at SNEC PV Power Expo

Reading time ( words)

The Assembly Division of MacDermid Alpha Electronics Solutions will be presenting a technical paper titled "Prevention of Weak Solder Joint Formation in Multi-Busbar (MBB) Interconnection" during the SNEC 13th (2019) International Photovoltaic (PV) Power Generation and Smart Energy Exhibition & Conference taking place June 3-6 in Shanghai, China. The paper will be focused on addressing the factors affecting reliability of solder joints in MBB technology.

"In multi-busbar (MBB) interconnection, between six and 15 round copper wires are soldered onto more than 50 solder pads on the front side of the solar cell. This approach reduces silver consumption for the front side metallization and increases the module efficiency by lowering series resistance and improved light harvesting," said Narahari Pujari, R&D Manager, Assembly Solutions. "However, due to reduced cross sectional area of silver pad and wire, reliability of solder joints remained one of the biggest concerns in this technology. Lowered peel strength, wire crippling and cold or dry solder joint formation are the most common issues."

Pujari's presentation is going to review and analyze the formation of weak joints and ways to obviate the same.

For more information on Alpha’s Solder Interconnect Technology, or Alpha’s other solutions for Photovoltaic applications, visit

About SNEC

SNEC is international PV tradeshow with high influence in China, Asia and rest of the world. SNEC showcases PV manufacturing facilities, materials, PV cells, PV application products & modules, and PV project and system, covering every section of the whole PV industry chain. The conference provides an excellent platform for the world's PV experts and scientists to showcase and share the latest developments in solar energy technologies.



Suggested Items

Juan Arango on Koh Young’s New U.S. Headquarters

10/27/2019 | Andy Shaughnessy, I-Connect007
At a recent open house, Managing Director Juan Arango talks about his role in the company’s transition from their Arizona facility to a new headquarters located outside of Atlanta, Georgia. Juan details many of the benefits customers can expect, including brand new spaces dedicated to customer demos as well as training.

SMTAI 2019: Chris Bastecki on Low-temperature Solder Challenges and Products

10/14/2019 | Real Time with...SMTAI
Chris Bastecki, director of global PCB assembly at Indium Corporation, discussed challenges of low-temperature solder and the company's new product, Durafuse LT, which provides novel properties and reliability.

Real Time with... SMTAI 2019 Video Interviews

10/09/2019 | Real Time with...SMTAI
The SMTA International Conference and Exhibition 2019, which took place September 22–26, 2019, at the Donald E. Stephens Convention Center in Rosemont, Illinois, concluded successfully. For those of you who were not able to make it to the show, catch our video interviews with the movers and shakers of the electronics industry. We've updated our video presentation for a better experience for our users, so check it out!

Copyright © 2019 I-Connect007. All rights reserved.