Thermaltronics Introduces New Line of Soldering Tips


Reading time ( words)

Thermaltronics USA, Inc., a manufacturer of soldering irons and robotic soldering systems incorporating the unique CURIE POINT Technology, including the award-winning TMT-9800S soldering robot, announces the development and introduction of a new range of new soldering tips designed specifically for difficult soldering applications.

A spokesperson for Thermaltronics said that over the past 18 months there has been a significant increase in demand for “high power” tips with good thermal bridging capability. This has been driven in part by the rise in the use of electric vehicles and the requirement for charging units incorporating PCBs with large components, ground planes and metal connectors.

While high solder temperatures are not recommended because cracking of the solder joint can occur, providing a way to transfer the thermal energy efficiently without causing damage can be a challenge. However, the new tips introduced by Thermaltronics and designated “H” or “HG” are providing customers with solutions not previously available.

About Thermaltronics USA, Inc.

Thermaltronics is a manufacturer and supplier of a wide range of soldering products and accessories used in the electronics manufacturing industry. Design and development is undertaken in the USA and Australia, with final production taking place in a customized manufacturing facility, incorporating specialized equipment and in accordance with recognized international standards of quality and compliance.

In addition to the modern factory, Thermaltronics maintains an office and warehouse in New York State, commercial offices in Hong Kong and a Distribution Sales Office in Perth Australia.

All Thermaltronics products are produced in accordance with ISO 9000 & ISO 14000 standards and meet either TUV, GS, CE or NRTL safety requirements. Strict quality control procedures are in place and product warranties are among the best in the industry. For more information, visit www.thermaltronics.com.

Share

Print


Suggested Items

What’s Driving AOI Innovation and Collaboration?

03/25/2020 | Brent Fischthal, Koh Young America
When we look at the optical inspection market growth trajectory, we can see how process challenges helped create innovations. For example, solder paste inspection (SPI) has undergone a shift from 2D to 3D because the 2D inspection technologies manufacturers traditionally used to collect solder deposit images could not solve shadowing problems. Thus, companies developed 3D SPI to capture the printed solder paste height to accurately measure the total volume of paste printed. Several years later, we see the same need for surface-mounted component inspection with AOI systems.

AIM Appoints Oscar Hernandez as Sales Manager for Queretaro and Bajio Regions Mexico

03/24/2020 | AIM Solder
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce the appointment of Oscar Hernandez to the position of Sales Manager for the Queretaro and Bajio regions of Mexico.

Trends From the Show: Solder and Software

03/18/2020 | Nolan Johnson, I-Connect007
In my role as a media representative, my perspective on IPC APEX EXPO may be a bit different from that of many attendees. Since the I-Connect007 team had the opportunity to talk to many attendees and exhibitors and listen to their stories over the course of the week, our view can be particularly wide. When I reflected on all the conversations, pieces from all throughout the week coalesced and provided a different understanding of and takeaway from the show.



Copyright © 2020 I-Connect007. All rights reserved.