Elements of Indium by Indium Corporation: Low Melting Point


Reading time ( words)

Indium Corporation is the global leader for indium metal and associated technologies. Because of its unique properties with virtually limitless applications, indium metal is literally all around us.

One of indium metal’s unique characteristics is its low-melting point. Low-temperature alloys, which typically contain indium or bismuth, melt at temperatures less than 180°C. These alloys are used in a wide variety of applications, including:

  • Step soldering involving temperature-sensitive components
  • Soldering to molded interconnect device (MID) plastics
  • Fusible alloys and fuse applications
  • Thermal and electrical conductivity

Because of its low melting point, indium and bismuth alloys have been used in fire suppression systems for years. These alloys melt at low enough temperatures—from 50°C to 100°C—to trigger safety devices in the event of a fire.

About Indium Corporation

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

Share

Print


Suggested Items

IPC’s Hand Soldering Competition Program: A Brief History

08/06/2019 | Philippe Leonard, Director, IPC Europe
The history of the IPC Hand Soldering Competition (HSC) grew from the 2010 Scandinavian Electronics Event which saw the first Swedish Championship in hand soldering organized by Lars Wallin IPC Europe, Lars-Gunnar Klag and Krister Park.

Practical Implementation of Assembly Processes for Low Melting Point Solder Pastes (Part 2)

07/24/2019 | Adam Murling, Miloš Lazić, and Don Wood, Indium Corporation; and Martin Anselm, Rochester Institute of Technology
In the last three to five years, there has been a resurgence of interest in the use of low melting point alloys for SMT applications. Typically, the compositions are around the eutectic bismuth-tin alloy, perhaps with additions of other elements to increase the robustness of certain alloy properties. Now, there are several new products on the market and numerous ongoing reliability projects in industry consortia.

Optimizing Solder Paste Volume for Low-Temperature Reflow of BGA Packages

07/22/2019 | Keith Sweatman, Nihon Superior Co. Ltd
In this article, Keith Sweatman explains how the volume of low-melting-point alloy paste—which delivers the optimum proportion of retained ball alloy for a particular reflow temperature—can be determined by reference to the phase diagrams of the ball and paste alloys.



Copyright © 2019 I-Connect007. All rights reserved.