KYZEN Showcases MICRONOX M2322 and M2708 at SEMICON West


Reading time ( words)

KYZEN plans to exhibit at SEMICON West, scheduled to take place July 9-11, 2019 at the Moscone Center in San Francisco. The KYZEN team will offer free cleaning assessments and an inside look at their chemistries, MICRONOX M2322 and MICRONOX M2708, in booth #5369.

To learn how KYZEN’s convergence of science and care will help you improve your cleaning process, complete a quick and easy cleaning assessment. A member from the Clean Team will review your results in a one-on-one discussion in Booth #5369.

MICRONOX MX2322 is a semiconductor-grade engineered semi aqueous solvent and designed to clean all types of paste fluxes common in wafer bumping, wafer level packaging, die attach, flip chip and SiP that contain copper pillar. MX2322 has a wide process window, as well as a long bath life, to remove tough flux residue at a fast rate and is compatible with all sensitive metals. The solvent demonstrates its excellent cleaning performance and benefits in single-wafer spray-in-air tools as well as all immersion cleaning systems.

MICRONOX MX2707 was formulated for the demanding cleaning challenges presented within leadless devices such as low standoff gaps and fine pitches of BGAs, flip chips, QFNs, LGAs and passives. MX2708 completely removes organic acid residues of all kinds at low, safe operating concentrations all while having no effect on exposed metal and intermetallic alloys including Cu, Al, Sn, Pb, Ni, Ag and Au finishes. MX2708 is a balanced cleaning agent designed around the critical process conditions that match the cleaning agent with water soluble flux pastes.

About KYZEN

KYZEN is a global leader in providing environmentally responsible, RoHS-compliant precision cleaning chemistries for industries ranging from electronics and advanced packaging to metal finishing and aerospace applications. Since its founding in 1990, KYZEN’s innovative cleaning technologies, scientific expertise and customer support have been repeatedly recognized with the industry’s most prestigious awards. For more information, visit www.kyzen.com.

 

Share

Print


Suggested Items

SMTA Europe Solder Finish Webinar Addresses Defects Causes and Cures

12/14/2020 | Pete Starkey, I-Connect007
“What is your most common PCB problem?” A survey conducted by Bob Willis had revealed finish solderability to be the predominant contender, and it was clear that the choice of solderable finish applied to surface mount boards could have a significant effect on the assembly yield and cost of the final circuit. SMTA Europe organised an informative and enlightening webinar this month entitled “Guide to PCB Solder Finishes—Process Defects Causes and Cures,” with soldering specialist Bob Willis as presenter.

Reducing Flux Splatter in Sensors and Camera Modules

10/30/2020 | Jasbir Bath, Shantanu Joshi, and Noriyoshi Uchida, Koki Solder America And Koki Company Limited
With the increased use of electronics in new technology areas, flux formulations are being developed to address the new and existing requirements. For sensors and camera modules used for Advanced Driver Assistance System (ADAS) and internet of things (IoT) applications, there is a demand for no-clean flux formulations in lead-free solder paste, which can reduce flux splattering during reflow.

How to Benefit From Robotic Soldering Processes

10/28/2020 | Pete Starkey, I-Connect007
Webinars are in vogue! But in Pete Starkey's experience, the master of the technical webinar with many years’ experience of delivering first-rate events is Bob Willis—electronics assembly specialist, soldering expert, and provider of training and consultancy in electronics manufacture. Here, Pete recaps Bob’s presentation on the upcoming robotic soldering experience.



Copyright © 2021 I-Connect007. All rights reserved.