Indium Launches New Low-Temperature Solder Paste


Reading time ( words)

Indium Corporation has released a new low-temperature solder paste specifically developed to minimize solder beading and solder balling. Indium5.7LT-1 is an air reflow, halogen-free, no-clean solder paste designed for low-temperature assembly processes using indium and bismuth alloys.

Indium 5.7LT-1 is engineered with a balanced set of properties for outstanding printing and soldering, including:

  • Low-temperature reflow
  • Clear post-reflow flux residue
  • High transfer efficiency and low variation
  • Excellent response-to-pause
  • Low-voiding in bottom termination components (QFNs), BGAs, LGAs
  • Excellent wetting

Indium5.7LT-1 is halogen-free per EN14582 test method. It joins Indium Corporation’s versatile high-performance, low-voiding solder pastes designed to accommodate a variety of industry requirements with lead-free, halogen-free, and no-clean options.

About Indium Corporation

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

Share

Print


Suggested Items

The Effectiveness of 75% IPA/25% DI Extraction Solution on No-clean Flux Residues

06/13/2019 | David Lober and Mike Bixenman, DBA, KYZEN; and Marietta Lemieux and Mark McMeen, STI
The continuous challenge in the electronics industry is to keep up with the demand for smaller, faster, and more reliable electronics. When it comes to cleaning, this rapid development of manufacturing and reliability challenges is juxtaposed with the slow pace of new test method development.

Laserssel Brings High-speed Soldering to New Application Areas

06/10/2019 | Barry Matties, I-Connect007
In this interview with I-Connect007, Denis Barbini, general manager of Laserssel, talks about the company's new laser-selective reflow solution aimed at reducing a typical reflow oven’s 10-minute cycle down to just 10 seconds as well as the overall benefits manufacturers could see from streamlining this process.

Minimizing Voids in Solder Joints

06/07/2019 | Rehm Thermal Systems
Dr. Hans Bell of Rehm Thermal Systems, Henryk Maschotta of Thales Deutschland GmbH, and Dr. Heinz Wohlrabe of TU Dresden presented the results of their project on reducing void content in the solder joints of land grid arrays (LGAs) at a soldering seminar during the Technology Days of the recent SMTconnect show in Nuremberg.



Copyright © 2019 I-Connect007. All rights reserved.