Wistron Uses AI in Defect Inspection


Reading time ( words)

Wistron has adopted AI technology to inspect defects of products at three of its factories and will extend such inspection to other plants, according to company senior software manger Liang Wei-quo.

Digitimes has reported that the AI-based defect inspection has been adopted for SMT (surface-mount technology) and DIP (dual in-line package) lines for producing notebooks and servers mainly.

Automatic optical inspection (AOI) may have high efficiency, but many manufacturers set AOI parameters at high levels in order to achieve high yield rates, resulting in over-sensitivity of the machine, and thus manual work is needed to double check the products for misjudged ones.

Share

Print


Suggested Items

Solder Mask Evolves into a Truly Additive Process

09/09/2019 | John Fix, Taiyo America Inc.
The 5G era is creating quite a bit of work for many PCB engineers as the materials required to keep up with the speed, frequency, and latency requirements need to be defined and qualified. Solder mask, for example, now becomes a truly additive process. Read on to find out how and why.

Recent Advances in X-ray Technology: SMTA Webinar Recap

08/12/2019 | Pete Starkey, I-Connect007
Technical Editor Pete Starkey recently attended a webinar on advances in X-ray technology and its applications in the electronics industry, as presented by Keith Bryant, Chair of SMTA Europe, on behalf of SMTA India. Here are the highlights of the webinar.

Cadence Design Systems Takes Tensilica to CES Show Floor

04/26/2019 | Nolan Johnson, I-Connect007
While roaming the aisles of CES, I happened across a suite hosted by Cadence Design Systems. It wasn’t a booth—just a quiet presence behind walls with demonstration hardware inside. Vic Markarian, senior group director for worldwide IP licensing and sales, explains why Cadence was at CES.



Copyright © 2019 I-Connect007. All rights reserved.