TRI Launches Smart Test and Inspection Solutions at NEPCON Asia

Reading time ( words)

Test Research, Inc. (TRI) will join NEPCON Asia held at the Shenzhen Exhibition & Convention Center to feature innovative SMT inspection solutions for the smart factories. Visit booth #1H55 to experience Smart Factory Inspection Solutions in action.

TRI will unveil the high-resolution 3D AXI TR7600F3D SII with unprecedented speed, twice as fast as its award-winning past models. Furthermore, TRI will be presenting the new multi-angle 3D AOI solution TR7500QE SII offering higher quality imaging. TRI is also featuring the new TR7700 SV 3D AOI combining high resolution with a 10 µm optical resolution and a 12MP high-speed camera.

The TRI lineup for NEPCON Asia will include the award-winning 3D AOI TR7700Q with leading-edge solder fillet inspection with 1um high-resolution inspection capability and the Global Technology Award-winning TR7007Q series 3D SPI, designed for zero-escape industry applications. Additionally TRI will present the Multicore ICT TR5001Q SII Inline and the brand new MDA TR518 SII Drawer with 2560 testing points.

Visit TRI's booth #1H55 at NEPCON Asia to discuss your production line requirements, and experience smart test and inspection solutions for the connected factory.

About TRI

Test Research, Inc. (TRI) offers the most robust product portfolio in the industry for automatic test and inspection solutions. From solder paste inspection (SPI), automated optical inspection (AOI), and 3D automated X-ray inspection (AXI) systems to manufacturing defect analyzers (MDA), in-circuit test equipment (ICT), and functional testing (FCT), TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing test and inspection requirements.  



Suggested Items

Comparing Soldering Results of ENIG and EPIG Post-steam Exposure

09/11/2019 | Jon Bengston and Richard DePoto, Uyemura International USA
Electroless nickel immersion gold (ENIG) is now a well-regarded finish used to enhance and preserve the solderability of copper circuits. Electroless palladium immersion gold (EPIG), meanwhile, is a new surface finish also for enhancing and preserving solderability—but with the advantage of eliminating electroless nickel from the deposit layer. This feature has become increasingly important with the increasing use of high-frequency PCB designs whereby nickel’s magnetic properties are detrimental.

Solder Mask Evolves into a Truly Additive Process

09/09/2019 | John Fix, Taiyo America Inc.
The 5G era is creating quite a bit of work for many PCB engineers as the materials required to keep up with the speed, frequency, and latency requirements need to be defined and qualified. Solder mask, for example, now becomes a truly additive process. Read on to find out how and why.

Selecting the Proper Flex Coverlayer Material

09/06/2019 | Dave Lackey, American Standard Circuits
Coverlayers are polymer materials used to cover and protect the copper traces of the flex circuit product. There are a number of different options available for protecting the circuits, and they serve different design requirements in terms of cost, performance, and flexural endurance optimization. When specifying the choice, it is critical to call out not just the type of coverlayer material but also the thickness requirement. This can be very important in certain types of constructions, especially when a flex circuit will experience dynamic flexing during use.

Copyright © 2019 I-Connect007. All rights reserved.