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Test Research, Inc. (TRI) will join NEPCON Asia held at the Shenzhen Exhibition & Convention Center to feature innovative SMT inspection solutions for the smart factories. Visit booth #1H55 to experience Smart Factory Inspection Solutions in action.
TRI will unveil the high-resolution 3D AXI TR7600F3D SII with unprecedented speed, twice as fast as its award-winning past models. Furthermore, TRI will be presenting the new multi-angle 3D AOI solution TR7500QE SII offering higher quality imaging. TRI is also featuring the new TR7700 SV 3D AOI combining high resolution with a 10 µm optical resolution and a 12MP high-speed camera.
The TRI lineup for NEPCON Asia will include the award-winning 3D AOI TR7700Q with leading-edge solder fillet inspection with 1um high-resolution inspection capability and the Global Technology Award-winning TR7007Q series 3D SPI, designed for zero-escape industry applications. Additionally TRI will present the Multicore ICT TR5001Q SII Inline and the brand new MDA TR518 SII Drawer with 2560 testing points.
Visit TRI's booth #1H55 at NEPCON Asia to discuss your production line requirements, and experience smart test and inspection solutions for the connected factory.
Test Research, Inc. (TRI) offers the most robust product portfolio in the industry for automatic test and inspection solutions. From solder paste inspection (SPI), automated optical inspection (AOI), and 3D automated X-ray inspection (AXI) systems to manufacturing defect analyzers (MDA), in-circuit test equipment (ICT), and functional testing (FCT), TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing test and inspection requirements.