Seica to Exhibit at Semicon West


Reading time ( words)

Seica, a leading provider of flying probe technology, will display their newest line of testers at Semicon west from July 9-11 at the Moscone Center in San Francisco, California. Seica's new testers bring key advances and features in the semiconductor market.

Seica will also exhibit semiconductor solutions  from our partners Crea, OSAI and Microtest.

Pilot V8 Next > series, the most complete flying probe test platform on the market, provides up to 20 mobile  resources for testing an electronic board, including test probes which can each apply currents up to 2 amps, high-resolution cameras for automatic optical inspection, barcode and data matrix reading capability, laser sensors, capacitive probes, pyrometers, optical fiber sensors for LEDs, mini-fixtures for boundary scan and On Board Programming, and high-frequency probes able to measure signals at frequencies over 1.5 GHz (an absolutely unique performance on the market).

Engineered for medium/high volume production, the Pilot V8 Next > series is available in a fully-automated version, capable of hosting up to 12 magazines of boards for testing (even of different types) or for direct connection to board loading/unloading and tilt modules, compatible with any standard assembly line. The Pilot V8 Next > series can be configured to satisfy the full range of different board test requirements: the HR (high resolution) version extends performance to include probing of extremely miniaturized devices (down to 30 µm), while the XL version expands the standard work area of 610 x 540 mm up to 800 x 650 mm, allowing the XL to accommodate and test extra-large boards.

The Pilot V8 Next> series–as all of the Next> series solutions–has Seica’s Industrial Monitoring Solution on board, featuring remote monitoring of current and voltage consumption, mains supply, temperature, light indicators and other parameters useful to indicate correct operation, to provide information enabling predictive maintenance and in general to render the systems compatible with today’s Industry 4.0 standards.

VIVA Next, together with Seica’s years of experience, provides intelligent integration with all aspects of the customer’s manufacturing processes: data collection, traceability, interaction with MES, repair operations. In short,  it includes all of the core concepts of Industry 4.0.

 

Share

Print


Suggested Items

The Long Road to a New Standard

09/17/2019 | Barry Matties, I-Connect007
Graham Naisbitt, chairman and CEO of Gen3 Systems, has spent decades leading cleanliness testing standards in a number of different standards organizations like IPC, IEC, and ISO around an assortment of testing methods, such as CAF, SIR, and even introducing a new standard this year for his own testing method—process ionic contamination testing (PICT). Naisbitt breaks down his long involvement with standards and where they stand currently.

The Four Things You Need to Know About Test

07/24/2019 | Neil Sharp, JJS Manufacturing
The electronics manufacturing process can often be extremely complex, and the costs associated with product recalls can be astronomical. A robust approach to test is key to ensuring the quality of your product and the satisfaction of your end user.

Approaches to Overcome Nodules and Scratches on Wire-Bondable Plating on PCBs

07/17/2019 | Young K. Song and Vanja Bukva, Teledyne Dalsa Inc., and Ryan Wong, FTG Circuits
Initially adopted internal specifications for acceptance of printed circuit boards (PCBs) used for wire bonding was that there were no nodules or scratches allowed on the wirebond pads when inspected under 20X magnification. This paper details if wire bonding could be successfully performed over nodules and scratches and if there was a dimensional threshold where wire bonding could be successful.



Copyright © 2019 I-Connect007. All rights reserved.