Indium Features Indium8.9HF Solder Paste Series at FIEE 2019


Reading time ( words)

Indium Corporation will help customers Avoid the Void with its void-reducing Indium8.9HF Solder Paste series at FIEE Smart Future, July 23-26, in São Paulo, Brazil.

Indium8.9HF is a proven solder paste series that delivers no-clean, halogen-free solutions designed to produce low-voiding, enhanced electrical reliability, and improved stability during the printing process. Under optimal process conditions, this solder paste series:

  • Exceeds all requirements for enhanced electrical reliability and SIR performance
  • Demonstrates consistent printing performance for up to 12 months when refrigerated
  • Maintains excellent printing and reflow performance after remaining at room temperature for one month
  • Delivers excellent response-to-pause, even after being left on the stencil for 60 hours
  • Resists premature flux spread to prevent surfaces from oxidizing
  • Performs with both Pb and Pb-free alloys
  • Meets HKMC MS184-01 testing criteria Type B—one of the automotive industry’s most stringent reliability criteria

The Indium8.9HF series provides unique oxidation barrier technology that eliminates HIP defects and graping, making solder pastes perfectly suited for automotive and electronics assembly applications.

About Indium Corporation

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com.

Share

Print


Suggested Items

Foundations of the Future: Get More Engaged in 2020

01/22/2020 | Charlene Gunter du Plessis, IPC Education Foundation
Since the inception of the IPC Education Foundation in January 2019, the mission remains to create connections between electronics manufacturers and supply chain companies, academia and the emerging workforce. In this debut column, Charlene Gunter du Plessis describes plans for engaging in 2020, including scholarships and more, and the IPC APEX EXPO 2020 STEM Student Outreach event.

CyberOptics Sensors: So Good That Their Rivals Use Them

12/20/2019 | Real Time with...productronica
Editor Nolan Johnson and Subodh discuss CyberOptics’ latest precision 3D systems, such as the SQ3000, which offers AOI, SPI and CMM functionalities. The inline CMM system includes top-of-the-line software for metrology grade measurements of critical points. Subodh points out that some of his competitors even utilize CyberOptics sensors in their equipment.

Global Political Turmoil Creating Uncertainties for the Industry

11/20/2019 | Chris Mitchell, IPC Vice President of Global Government Relations
From where I sit, representing the interests of electronics manufacturers and related companies around the world, I regret to say that the future of our industry—while bright overall—is fraught with uncertainties, from trade policy disputes to government leadership turnovers and economic and social megatrends. IPC is working with all governments and parties to overcome these uncertainties, but there is a lot to tackle.



Copyright © 2020 I-Connect007. All rights reserved.