Indium Features Indium8.9HF Solder Paste Series at FIEE 2019


Reading time ( words)

Indium Corporation will help customers Avoid the Void with its void-reducing Indium8.9HF Solder Paste series at FIEE Smart Future, July 23-26, in São Paulo, Brazil.

Indium8.9HF is a proven solder paste series that delivers no-clean, halogen-free solutions designed to produce low-voiding, enhanced electrical reliability, and improved stability during the printing process. Under optimal process conditions, this solder paste series:

  • Exceeds all requirements for enhanced electrical reliability and SIR performance
  • Demonstrates consistent printing performance for up to 12 months when refrigerated
  • Maintains excellent printing and reflow performance after remaining at room temperature for one month
  • Delivers excellent response-to-pause, even after being left on the stencil for 60 hours
  • Resists premature flux spread to prevent surfaces from oxidizing
  • Performs with both Pb and Pb-free alloys
  • Meets HKMC MS184-01 testing criteria Type B—one of the automotive industry’s most stringent reliability criteria

The Indium8.9HF series provides unique oxidation barrier technology that eliminates HIP defects and graping, making solder pastes perfectly suited for automotive and electronics assembly applications.

About Indium Corporation

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com.

Share

Print


Suggested Items

Combating ESD: The Silent Assassin in Electronics Manufacturing

09/20/2019 | Neil Sharp, JJS Manufacturing
ESD is a constant but invisible force within electronics manufacturing that can have a powerfully detrimental impact on production yield, product and product reliability, and company profitability. And as the circuitry within electronic devices continues to get faster, smaller, and more sophisticated, their sensitivity to the effects of ESD is only likely to increase.

Meet Dr. Bill Cardoso, SMT007 Columnist

09/03/2019 | I-Connect007
Dr. Bill Cardoso started his first company at age 17 in Brazil, selling it a few years later to work for the U.S. Department of Energy’s Fermi National Accelerator Laboratory, where he led research in nuclear physics to build the equipment that discovered the Higgs Boson (and the 2013 Nobel Prize in Physics). After 10 years at Fermilab, he moved from Chicago to sunny San Diego to start Creative Electron in his garage in 2008.

eSMART Factory Conference 2019, Day 1

09/02/2019 | Happy Holden, I-Connect007
The recent eSMART Factory Conference in June in Dearborn, Michigan, was the second annual conference on the smart factory. SMTA described it as "A technical conference with a focus on electronics manufacturing from software systems/processes to augmented reality and smart inspection." In this article, Happy Holden gives us the highlights of the conference.



Copyright © 2019 I-Connect007. All rights reserved.