CyberOptics Wins Best of West Award at SEMICON West


Reading time ( words)

CyberOptics Corporation announced that SEMI, the global industry association representing the electronics manufacturing and design supply chain, and Semiconductor Digest presented the 2019 Best of West award to CyberOptics for the new NanoResolution MRS Sensor. The award recognizes important product and technology developments in the electronics manufacturing supply chain.

For mid-end and advanced packaging inspection and measurement, CyberOptics new proprietary NanoResolution Multi-Reflection Suppression (MRS) sensor technology meticulously identifies and rejects multiple reflections caused by shiny components and mirror-like surfaces. Effective suppression of multiple reflections is critical for highly accurate measurements.

“There’s a big emphasis on metrology at this year’s SEMICON West,” said Pete Singer, editor in chief of Semiconductor Digest. “The CyberOptics MRS Sensor is a great example of a fantastic new tool now available to semiconductor manufacturers.”

The 3-micron NanoResolution MRS sensor (X/Y resolution of 3 micron, Z resolution of 50 nanometer) enables metrology grade accuracy with superior 100% 2D and 3D inspection performance for features as small as 25-micron. Further, it is two to three times faster than alternate solutions in the marketplace. With data processing speeds in excess of 75 million 3D points per second, it delivers throughput greater than 25 wafers (300mm) per hour. 100% 2D and 3D inspection can be completed simultaneously at high speed, versus an alternate, slow method that requires two separate scans for 2D and 3D, and only a sampling of a few dies of the 25 wafers.

“We are honored to win the 2019 Best of West award for the NanoResolution MRS sensor,” said Dr. Subodh Kulkarni, President and CEO, CyberOptics. “I am very proud of our R&D and technical team that advanced our MRS sensor capabilities to address the mid-end and advanced packaging market.”

Offering an unparalleled combination of high accuracy, high resolution and speed, best-in-class MRS sensor technology is widely used for inspection and measurement in the SMT, semiconductor and metrology markets. The new NanoResolution MRS sensor is ideally suited for the inspection of CPU sockets, IC package, solder balls and bumps, copper pillars, and other advanced packaging and mid-end semiconductor applications where high precision and speed are needed.

About CyberOptics

CyberOptics Corporation is a leading global developer and manufacturer of high precision sensing technology solutions. CyberOptics’ sensors are used in SMT, semiconductor and metrology markets to significantly improve yields and productivity. By leveraging its leading edge technologies, the company has strategically established itself as a global leader in high precision 3D sensors, allowing CyberOptics to further increase its penetration of key vertical markets. Headquartered in Minneapolis, Minnesota, CyberOptics conducts worldwide operations through its facilities in North America, Asia and Europe.

Share

Print


Suggested Items

Practical Implementation of Assembly Processes for Low Melting Point Solder Pastes (Part 1)

07/16/2019 | Adam Murling, Miloš Lazić, and Don Wood, Indium Corporation; and Martin Anselm, Rochester Institute of Technology
Since 2006 and the implementation of the RoHS directive, the interest in bismuth-tin solder alloys—whose melting point around 140°C is very desirable because it allows for the use of lower temperature laminate materials and reduces thermal stress on sensitive components—has only increased as the industry has searched for Pb-free alternatives to the chosen standard, SAC305, which melts at considerably higher temperatures than the incumbent tin-lead alloys.

Surface Treatment Enabling Low-Temperature Soldering to Aluminum

07/15/2019 | Divyakant Kadiwala, Averatek Corporation
An increasingly popular method to meet the need for lower cost circuitry is the use of aluminum on polyester (Al-PET) substrates. This material is gaining popularity and has found wide use in RFID tags, low-cost LED lighting, and other single-layer circuits. However, both aluminum and PET have their own constraints and require special processing to make finished circuits.

Failures and Reliability in Soldering

07/09/2019 | Michael Gouldsmith and Zen Lee, Thermaltronics
The definition of failure is "the lack of success in doing or achieving something, especially in relation to a particular activity." If the activity is concerning a soldering process, such a failure can have a downstream impact far beyond the actual solder joint. In this regard, it is first necessary to understand what constitutes a good solder joint because appearance is too often deemed a success.



Copyright © 2019 I-Connect007. All rights reserved.