YINCAE Advanced Materials to Exhibit and Present at IMAPS 2019


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YINCAE Advanced Materials is proud to announce that we will be exhibiting at this year’s IMAPS 2019 Boston 52nd International Symposium on Microelectronics, at the Hynes Convention Center, in Boston, MA on October 1-2, 2019.

The International Microelectronics Assembly and Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. 

YINCAE offers a variety of exclusive materials such as thermal interface and wafer-level /packaging level/board level materials, die attach adhesives and underfill that have been adopted by leading contract manufacturers and tier 1 microelectronic customers, and we are excited to be showcasing some or our most popular products at iMAPS 52nd International Symposium on Microelectronics.  YINCAE innovated the world’s first lead-free solder joint encapsulation adhesive solution for wafer level, flip chip, POP, LGA, BGA and many other applications.  YINCAE offers SJEA for low, medium and high temperature solder alloy applications for your unique applications.  YINCAE underfills not only offer high thermal conductivity and high Tg (245degC) but also can be used at over 400degC.

About  YINCAE Advanced Materials

Founded and headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives, and electronic materials used in microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives. 

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