KIC's MB Allen to Present 'Optimization of the Reflow Profile to Minimize Voiding'


Reading time ( words)

KIC announced that MB Allen, manager for KIC’s Applications & Sales, will present at the SMTA Capital Expo & Tech Forum, scheduled to take place Thursday, August 22, 2019 at the Johns Hopkins University/Applied Physics Lab in Laurel, Maryland. Allen will present “Optimization of the Reflow Profile to Minimize Voiding.”

Void reduction is a significant concern and controversial topic in electronic assembly. Voiding impacts electrical, thermal and mechanical performance. There are many variables such as substrates, components, solder paste, acceptable void levels and of course the reflow profile. This discussion will focus on the optimization of the reflow profile as one of the solutions for the reduction of voiding.

KIC also will showcase the Reflow Process Inspection system, RPI i4.0, automatic profiling system with integrated network software for real-time data sharing, dashboard and traceability.

MB Allen is a manager for KIC’s Applications & Sales in the Americas. Her technical expertise, relationships with valued partners and customers, and many years of sales experience aid KIC in the future development, improvement and sales of the company’s product offerings. MB has worked in electronics industry for 31 years and been associated with KIC for 30 years with both national and international positions.

About KIC

KIC is a technology company working to make reflow ovens smarter through thermal profiling automation and optimization solutions. With offices across the globe, KIC is ready to become your partner in oven-based manufacturing.  Corporate headquarters are located at 16120 W Bernardo Dr., San Diego, CA 92127. For more information about KIC, visit www.kicthermal.com.

Share

Print


Suggested Items

Advancement of SPI Tools to Support Industry 4.0 and Package Scaling

08/06/2019 | A. Prasad, L. Pymento, S.R. Aravamudhan, and C. Periasamy, Intel Corp.
This paper evaluates the current state of inline SPI tools from multiple vendors for solder paste measurement accuracy and capability. It discusses a measurement capability analysis that was carried out against a golden metrology tool across a range of volume deposits, and highlights the results from the study.

Practical Implementation of Assembly Processes for Low Melting Point Solder Pastes (Part 2)

07/24/2019 | Adam Murling, Miloš Lazić, and Don Wood, Indium Corporation; and Martin Anselm, Rochester Institute of Technology
In the last three to five years, there has been a resurgence of interest in the use of low melting point alloys for SMT applications. Typically, the compositions are around the eutectic bismuth-tin alloy, perhaps with additions of other elements to increase the robustness of certain alloy properties. Now, there are several new products on the market and numerous ongoing reliability projects in industry consortia.

The Four Things You Need to Know About Test

07/24/2019 | Neil Sharp, JJS Manufacturing
The electronics manufacturing process can often be extremely complex, and the costs associated with product recalls can be astronomical. A robust approach to test is key to ensuring the quality of your product and the satisfaction of your end user.



Copyright © 2019 I-Connect007. All rights reserved.