SMTA Releases Benefits Book for Young Professionals


Reading time ( words)

The SMTA is pleased to announce the release of the 2019 Young Professionals Benefits Book. The Benefits Book encompasses six key benefits available to Student and Young Professional members at no additional cost.

In response to the needs voiced by members in the early stages of their electronics manufacturing career, SMTA developed an e-book that provides resources for career management, networking, resume building, job searching, technical paper writing and more.

This new resource also provides a recruitment section for Corporate Members who are actively recruiting. The e-book includes details on how to find internships, apprenticeships, and potential job opportunities, along with direct contact information for their hiring departments.

About SMTA - A Global Association Working at a Local Level

The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

Share

Print


Suggested Items

The Convergence of Technologies and Standards in Smart Manufacturing

04/29/2020 | Ranjan Chatterjee, Cimetrix Inc., and Dan Gamota, Jabil Inc.
Ranjan Chatterjee of Cimetrix and Daniel Gamota of Jabil teamed up to bring you this article, originally published as the paper "The Convergence of Technologies and Standards Across the Electronic Products Manufacturing Industry (SEMI, OSAT, and PCBA) to Realize Smart Manufacturing."

What’s Driving AOI Innovation and Collaboration?

03/25/2020 | Brent Fischthal, Koh Young America
When we look at the optical inspection market growth trajectory, we can see how process challenges helped create innovations. For example, solder paste inspection (SPI) has undergone a shift from 2D to 3D because the 2D inspection technologies manufacturers traditionally used to collect solder deposit images could not solve shadowing problems. Thus, companies developed 3D SPI to capture the printed solder paste height to accurately measure the total volume of paste printed. Several years later, we see the same need for surface-mounted component inspection with AOI systems.

Meet Alfred Macha, SMT007 Columnist

11/06/2019 | I-Connect007 Editorial Team
Meet Alfred Macha, one of our SMT007 columnists! Macha’s columns concentrate on process validation, supply chain management, quality management systems, government contracts, FDA regulations, process controls, and more. Alfred Macha brings 20 years of senior leadership roles in quality and operations management working for Sanmina, DDi (now TTM Technologies), Anaren (now TTM Technologies), and HEI Microelectronics.



Copyright © 2020 I-Connect007. All rights reserved.