STI and Contributors to Present Results of Two Research Papers at SMTAI


Reading time ( words)

STI Electronics, Inc. in cooperation with lead author Mike Bixenman, DBA, KYZEN, and other contributors, announces two technical paper presentations in September at the SMTA International Technical Conference (SMTAI).

The papers focus on the problem of cleanliness for QFN component packages and risk management for Class 3 hardware. With the increased focus on cleanliness throughout electronics manufacturing, this topic is of great interest across the industry. Mark McMeen, STI’s VP of Engineering Services and Manufacturing, has been busy working on the evaluation of cleanliness and its effects on reliability for all hardware with a focus on IPC Class 3 products.

Attendees at the SMTAI Conference will have the opportunity to attend two presentations. The conference will take place at the Donald E. Stephens Convention Center, Sept. 22-26, 2019 in Rosemont, Illinois.

The first paper, “Characterize and Understand Functional Performance of Cleaning QFN Packages on PCB Assemblies—iNEMI Cleanliness Research Study” is the result of 18 contributors who came together to predict and understand the functional performance of residues present under single row QFN component packages. The group’s objective was to develop and collect a set of guidelines for understanding the relationship between ionic contamination levels, and cleanliness. With the knowledge gained, the team will establish a reference Test Suite and Test Spec for cleanliness.

The second presentation will be, “Risk Management of Class 3 Electronics as a Function of Cleanliness.” The advanced technology and harsh environments inherent in Class 3 hardware and their production means that all aspects of the systems must be evaluated for reliability. The purpose of the paper is to apply risk management strategies to contaminations. The information gained will be used to improve methods of proving out and developing better methods for qualifying soldering and cleaning processes at the point of manufacture.

Click on the following link for information and registration for the SMTA International Technical Conference.

Share

Print


Suggested Items

Real Time with… SMTAI 2020: Insituware Offers Handheld Process Controls for the Smart Factory

09/21/2020 | Real Time with...SMTAI
Nolan Johnson speaks with Insituware CEO and Chief Engineer Michael Frederickson. Insituware’s expertise in materials control and measurement brings some innovative new handheld measurement devices to the manufacturing floor. Mike and Nolan discuss how these new devices contribute to accuracy, compliance, and real-time process optimization—all key factors in the smart factory environment. Mike also teases what the company will demonstrate in their virtual booth at SMTAI.

Real Time with…SMTAI 2020: SMTA International Goes Virtual

09/16/2020 | Nolan Johnson, I-Connect007
Nolan Johnson connected with three SMTA principals—KYZEN’s Debbie Carboni, SMTA’s Ryan Flaherty, and Rockwell’s Greg Vance—to discuss the upcoming 2020 SMTA International (SMTAI) event, the first major electronics manufacturing conference and exhibition to go virtual this year. The panel gives an overview of exhibits, technical conference presentations, and professional networking in this new format. and provides some coaching on how to to get the most from this virtual event.

Real Time with…SMTAI 2020: Koh Young on New Products and the Role of AI

09/16/2020 | I-Connect007 Editorial Team
Nolan Johnson speaks with Joel Scutchfield, director of sales for the Americas, about Koh Young's exhibit at SMTAI. Scutchfield outlines all the new products being displayed in the virtual booth and discusses the increased role that the company sees for AI in their products and the smart factory flow.



Copyright © 2020 I-Connect007. All rights reserved.