-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
STI and Contributors to Present Results of Two Research Papers at SMTAI
July 25, 2019 | STI ElectronicsEstimated reading time: 1 minute
STI Electronics, Inc. in cooperation with lead author Mike Bixenman, DBA, KYZEN, and other contributors, announces two technical paper presentations in September at the SMTA International Technical Conference (SMTAI).
The papers focus on the problem of cleanliness for QFN component packages and risk management for Class 3 hardware. With the increased focus on cleanliness throughout electronics manufacturing, this topic is of great interest across the industry. Mark McMeen, STI’s VP of Engineering Services and Manufacturing, has been busy working on the evaluation of cleanliness and its effects on reliability for all hardware with a focus on IPC Class 3 products.
Attendees at the SMTAI Conference will have the opportunity to attend two presentations. The conference will take place at the Donald E. Stephens Convention Center, Sept. 22-26, 2019 in Rosemont, Illinois.
The first paper, “Characterize and Understand Functional Performance of Cleaning QFN Packages on PCB Assemblies—iNEMI Cleanliness Research Study” is the result of 18 contributors who came together to predict and understand the functional performance of residues present under single row QFN component packages. The group’s objective was to develop and collect a set of guidelines for understanding the relationship between ionic contamination levels, and cleanliness. With the knowledge gained, the team will establish a reference Test Suite and Test Spec for cleanliness.
The second presentation will be, “Risk Management of Class 3 Electronics as a Function of Cleanliness.” The advanced technology and harsh environments inherent in Class 3 hardware and their production means that all aspects of the systems must be evaluated for reliability. The purpose of the paper is to apply risk management strategies to contaminations. The information gained will be used to improve methods of proving out and developing better methods for qualifying soldering and cleaning processes at the point of manufacture.
Click on the following link for information and registration for the SMTA International Technical Conference.
Suggested Items
IDTechEx Examines the Opportunities for Wearables in Digital Health
04/19/2024 | IDTechExIDTechEx’s report, “Digital Health and Artificial Intelligence 2024-2034: Trends, Opportunities, and Outlook”, covers this ongoing trend in the consumer health wearables market and includes analysis of the opportunities and roadmap for biometric monitoring.
ZESTRON Welcomes Whitlock Associates as New Addition to their Existing Rep Team in Florida
04/19/2024 | ZESTRONZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is thrilled to announce the addition of Whitlock Associates to its esteemed network of sales representatives.
IPC Bestows Posthumous Hall of Fame Award to Industry Icon Michael Ford
04/18/2024 | IPCIPC honored the late Michael Ford, Aegis Software, for his extraordinary contributions to the global electronics manufacturing industry with the IPC Raymond E. Pritchard Hall of Fame Award at IPC APEX EXPO 2024. IPC’s most prestigious honor, the Hall of Fame Award is given to individuals who have provided exceptional service and advancement to IPC and the electronics industry. Ford, an industry leader and valued IPC volunteer, died suddenly in January 2024.
SEMI Applauds U.S. Chips Act Award for Samsung Electronics Facilities to Strengthen Domestic Semiconductor Supply Chain
04/17/2024 | SEMISEMI, the industry association serving the global electronics design and manufacturing supply chain, applauded the United States Department of Commerce’s announcement of a Preliminary Memorandum of Terms for an award under the CHIPS and Science Act to support the expansion of Samsung Electronics’ presence in Texas and the company’s development and production of leading-edge chips.
Northrop Grumman honors Calumet Electronics with Supplier Excellence Award
04/17/2024 | Calumet ElectronicsNorthrop Grumman Corporation has recognized Calumet Electronics during the company’s 2024 Supplier Excellence Awards for “exceptional performance and unwavering commitment to delivering with excellence.” Calumet is one of 70 suppliers recognized from across the globe. In its award category of “Supplier Strategic Excellence,” Calumet was honored alongside global corporations such as Amazon Web Services, Dell Technologies, and Eaton Corporation.