Indium to Feature “No-Spatter” Flux-Cored Wire at SMTA International


Reading time ( words)

Indium Corporation will feature its “no-spatter” flux-cored wire, Core 230-RC, at SMTA International, September 22-26, in Rosemont, Illinois, USA.

Indium Corporation’s Core 230-RC is specially developed to meet the demanding requirements of robotic and laser soldering. Fully REACH- and RoHS-compliant, it delivers an impressive <1% total flux spatter, as tested per IPC TM-650 2.4.48 standards.

Core 230-RC also performs exceptionally well in hand-soldering applications. Its “no-spatter” feature ensures that flux does not contaminate gold fingers or other contacts where it can interfere with circuit board electrical properties or spatter hot flux on operators’ hands. It is available in lead-free, tin-lead, and high-lead cored wires. Indium Corporation flux-cored wire offers:

  • Layers evenly wound onto spools to avoid tangles during use
  • Consistent diameters that meet the most stringent requirements
  • No flux voids within the wire for consistent, worry-free soldering

About Indium Corporation

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

Share

Print


Suggested Items

IPC’s Hand Soldering Competition Program: A Brief History

08/06/2019 | Philippe Leonard, Director, IPC Europe
The history of the IPC Hand Soldering Competition (HSC) grew from the 2010 Scandinavian Electronics Event which saw the first Swedish Championship in hand soldering organized by Lars Wallin IPC Europe, Lars-Gunnar Klag and Krister Park.

Practical Implementation of Assembly Processes for Low Melting Point Solder Pastes (Part 2)

07/24/2019 | Adam Murling, Miloš Lazić, and Don Wood, Indium Corporation; and Martin Anselm, Rochester Institute of Technology
In the last three to five years, there has been a resurgence of interest in the use of low melting point alloys for SMT applications. Typically, the compositions are around the eutectic bismuth-tin alloy, perhaps with additions of other elements to increase the robustness of certain alloy properties. Now, there are several new products on the market and numerous ongoing reliability projects in industry consortia.

Optimizing Solder Paste Volume for Low-Temperature Reflow of BGA Packages

07/22/2019 | Keith Sweatman, Nihon Superior Co. Ltd
In this article, Keith Sweatman explains how the volume of low-melting-point alloy paste—which delivers the optimum proportion of retained ball alloy for a particular reflow temperature—can be determined by reference to the phase diagrams of the ball and paste alloys.



Copyright © 2019 I-Connect007. All rights reserved.