SlingShot Assembly Acquires Jade Electronics


Reading time ( words)

SlingShot Assembly has announced its second acquisition in two years. To continue its quest to provide industry-leading customer experience in the PCB assembly sector, SlingShot has acquired the assets of Jade Electronics of Kenosha, Wisconsin. Jade’s assets, employees, and customers will be transferred to SlingShot’s nearby facility in Franksville, WI, which was acquired by SlingShot in 2018.

Jade’s founder and CEO, Jerry Phillips, will assist with the transition for up to one year. The integration is expected to be completed within 30 days. Financial terms of the transaction were not disclosed.

Founded in 1992, Jade has provided high-quality electronic assembly services to a variety of customers and markets for over 25 years. Jade has been ISO certified and an IPC member for many years and has exceptional expertise in aerospace and LED lighting.

SlingShot Assembly, established in 2016 by a team led by industry veteran Stuart McKeel, president, is changing how engineers and their companies think about prototype PCB projects. Tapping into the power of the industry’s best software and automated assembly equipment, SlingShot completes high quality, full turn-key PCB assemblies in as little as 72 hours. Customers can quote and order projects online in minutes or, if they prefer, work through a dedicated service and engineering team to quote and place orders. SlingShot’s engineering team runs each order through the industry’s leading Design for Assembly (DFA) software to address design issues pre-assembly, saving time and money and often eliminating entire prototype revisions. Visit www.slingshotassembly.com for more information.

GP Ventures served as financial advisor to SlingShot Assembly. GP Ventures is an M&A advisory services firm focused on the tech and electronics industries. For more information, please visit our website at www.gp-ventures.com.

Share

Print


Suggested Items

Process Ionic Contamination Test (PICT) Standard Roundtable With Industry Experts

04/22/2020 | I-Connect007
With standards committees set to release the first of four new test standards, industry experts discussed the process ionic contamination test (PICT) standard, which was recently approved by the IEC for publication. Roundtable participants included Teresa Rowe, senior director of assembly and standards technology at IPC, Graham Naisbitt, chairman and CEO of Gen3, Jason Keeping, corporate process development at Celestica, and Doug Pauls, principal materials and process engineer at Collins Aerospace.

SMTA Europe’s Electronics in Harsh Environments Conference and Exhibition: A Taste of Things to Come

04/14/2020 | Pete Starkey, I-Connect007
SMTA Europe’s Electronics in Harsh Environments Conference has become a must-attend annual event; unfortunately, it also became another casualty of the COVID-19 lockdown. Scheduled to take place in Amsterdam, the Netherlands, from April 21–23, 2020, it has now been postponed until December 1–3. Pete Starkey reports on a preview seminar presented by SMTA Europe.

This Month in SMT007 Magazine: Exclusive Interview With Burt Rutan, Aerospace Legend

04/03/2020 | I-Connect007 Editorial Team
If you follow advancements in aerospace technologies and expeditions, then you know the name Burt Rutan. Described by Newsweek as “the man responsible for more innovations in modern aviation than any living engineer,” Rutan is a bold visionary with a passion for the advancement of technology, who has designed 46 aircraft throughout his career. Following his IPC APEX EXPO keynote presentation, Rutan stopped by the I-Connect007 booth and shared his thoughts on a wide variety of topics.



Copyright © 2020 I-Connect007. All rights reserved.