-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Laserssel Appoints Kurt Whitlock Associates as Newest Rep
August 5, 2019 | LasersselEstimated reading time: 2 minutes
Laserssel has announced their newest rep appointment of Mike Holleran of Kurt Whitlock Associates, who will cover all of Florida.
“We are absolutely thrilled to partner with Kurt,” commented Denis Barbini, Ph.D, Managing Director of the USA for Laserssel. “Florida is a hotspot with many potential customers, and we trust that Kurt and his team will be the best match to help us break into the region.”
Laser Selective Reflow (LSR) is designed to deliver a uniform defocused laser beam over a specifically tailored area on a PCB. The uniform defocused beam is controlled and delivered to the product via the BSOM (Beam Shaping Optic Module system) on user defined area. This unique feature permits the user to implement novel soldering solutions not possible with past techniques. It also allows the selective application of energy to locations that require soldering while not heating up potentially thermally sensitive areas. LSR is potentially a means to also mitigate or even eliminate the warpage of various packages. It provides super reliable and fast, only 1~3 seconds laser bonding per selected area, bonding process. It was made possible by highly uniform optic system and distinctive recipe developed by Laserssel.
For the 40 years, Kurt Whitlock Associates has searched the world for cutting edge companies to represent and distribute to electronics assembly customers and potential markets. Their array of companies provide unmatched solutions to meet high volume, high mix, and mid to low volume requirements with the same level of service and technical support.
“I think Laserssel has an innovative technology that will help streamline their customers’ process and add measurable benefits,” added Mike Holleran, “and I think it’s going to be a no brainer for most people looking to invest in a laser selective reflow solution.”
About Laserssel
Laserssel Corporation is a leading provider of laser selective soldering technology supporting global semi-conductor, automotive, consumer, communications, military and industrial segments. As a pioneer in selective soldering segments, Laserssel has provided customers with unique soldering capabilities to allow to solder on heat sensitive substrates that were considered to be impossible to reflow. Laserssel is now expanding its product offerings in advanced packaging, plastic and organic substrates, very thin substrates with concern of warpage and any other challenges that were difficult, if not impossible, in conventional reflow process. Combined with its extensive knowledge in laser technology and expertise in process technology, Laserssel is well positioned to help customers to solve problems in the space of packaging and assembling the next generation of electronic devices. Please visit www.laserssel.com for more information.
Suggested Items
Hentec/RPS Publishes an Essential Guide to Selective Soldering Processing Tech Paper
04/17/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing the critical process parameters that need to be optimized to ensure optimal results and guarantee the utmost in end-product quality.
Empowering Electronics Assembly: Introducing ALPHA Innolot MXE Alloy
04/16/2024 | MacDermid Alpha Electronics SolutionsIn the rapidly evolving electronics industry, where innovation drives progress, MacDermid Alpha Electronics Solutions is committed to setting a new standard. Today, we are pleased to introduce ALPHA Innolot MXE, a revolutionary alloy meticulously engineered to address the critical needs of enhanced reliability and performance in modern electronic assemblies.
New Book on Low-temperature Soldering Now Available
04/17/2024 | I-Connect007I-Connect007 is pleased to announce that The Printed Circuit Assembler’s Guide to… Low-temperature Soldering, Vol. 2, by subject matter experts at MacDermid Alpha Electronics Solutions, is now available for download.
Inkjet Solder Mask ‘Has Arrived’
04/10/2024 | Pete Starkey, I-Connect007I was delighted to be invited to attend an interactive webinar entitled “Solder Mask Coating Made Easy with Additive Manufacturing,” hosted by SUSS MicroTec Netherlands in Eindhoven. The webinar was introduced and moderated by André Bodegom, managing director at Adeon Technologies, and the speakers were Mariana Van Dam, senior product manager PCB imaging solutions at AGFA in Belgium; Ashley Steers, sales manager at Electra Polymers in the UK; and Dr. Luca Gautero, product manager at SUSS MicroTec Netherlands.
TE Connectivity Orders Hentec Industries/RPS Automation Pulsar Solderability Testing System
04/09/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that TE Connectivity has finalized the purchase of a Pulsar solderability testing system.