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Laserssel has announced their newest rep appointment of Mike Holleran of Kurt Whitlock Associates, who will cover all of Florida.
“We are absolutely thrilled to partner with Kurt,” commented Denis Barbini, Ph.D, Managing Director of the USA for Laserssel. “Florida is a hotspot with many potential customers, and we trust that Kurt and his team will be the best match to help us break into the region.”
Laser Selective Reflow (LSR) is designed to deliver a uniform defocused laser beam over a specifically tailored area on a PCB. The uniform defocused beam is controlled and delivered to the product via the BSOM (Beam Shaping Optic Module system) on user defined area. This unique feature permits the user to implement novel soldering solutions not possible with past techniques. It also allows the selective application of energy to locations that require soldering while not heating up potentially thermally sensitive areas. LSR is potentially a means to also mitigate or even eliminate the warpage of various packages. It provides super reliable and fast, only 1~3 seconds laser bonding per selected area, bonding process. It was made possible by highly uniform optic system and distinctive recipe developed by Laserssel.
For the 40 years, Kurt Whitlock Associates has searched the world for cutting edge companies to represent and distribute to electronics assembly customers and potential markets. Their array of companies provide unmatched solutions to meet high volume, high mix, and mid to low volume requirements with the same level of service and technical support.
“I think Laserssel has an innovative technology that will help streamline their customers’ process and add measurable benefits,” added Mike Holleran, “and I think it’s going to be a no brainer for most people looking to invest in a laser selective reflow solution.”
Laserssel Corporation is a leading provider of laser selective soldering technology supporting global semi-conductor, automotive, consumer, communications, military and industrial segments. As a pioneer in selective soldering segments, Laserssel has provided customers with unique soldering capabilities to allow to solder on heat sensitive substrates that were considered to be impossible to reflow. Laserssel is now expanding its product offerings in advanced packaging, plastic and organic substrates, very thin substrates with concern of warpage and any other challenges that were difficult, if not impossible, in conventional reflow process. Combined with its extensive knowledge in laser technology and expertise in process technology, Laserssel is well positioned to help customers to solve problems in the space of packaging and assembling the next generation of electronic devices. Please visit www.laserssel.com for more information.