Indium Launches IndiOx


Reading time ( words)

Indium Corporation has released IndiOx (In2O3) for use in the manufacture of ITO sputtering targets for thin-film coating. IndiOx (In2O3) is a stable ceramic-like material that is insoluble in water and volatizes at 850°C.

When doped with tin oxide, IndiOx forms ITO, the material of choice to form transparent conductive oxide (TCO) layers in flat-panel displays and touch sensors for mobile devices. The ITO layer is deposited onto glass from a sputtering target that is manufactured from the ITO powder by sintering.  

Other uses for IndiOx include glass coloring, gassing suppression in alkaline batteries, and as an anti-arcing additive in high current electrical switches and contactors.

IndiOx is available in three powder types:

  • Type A – Crystalline: particle size distribution D10–D90 ranges from 0.8–38μm.
  • Type B – Fine: particle size distribution D10–D90 ranges from 0.5–6μm.
  • Type T – Target Grade: particle size distribution D10–D90 ranges from 0.1–7.5μm. The primary particle size is about 100nm.

About Indium

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com.

Share

Print


Suggested Items

Practical Implementation of Assembly Processes for Low Melting Point Solder Pastes (Part 2)

07/24/2019 | Adam Murling, Miloš Lazić, and Don Wood, Indium Corporation; and Martin Anselm, Rochester Institute of Technology
In the last three to five years, there has been a resurgence of interest in the use of low melting point alloys for SMT applications. Typically, the compositions are around the eutectic bismuth-tin alloy, perhaps with additions of other elements to increase the robustness of certain alloy properties. Now, there are several new products on the market and numerous ongoing reliability projects in industry consortia.

Practical Implementation of Assembly Processes for Low Melting Point Solder Pastes (Part 1)

07/16/2019 | Adam Murling, Miloš Lazić, and Don Wood, Indium Corporation; and Martin Anselm, Rochester Institute of Technology
Since 2006 and the implementation of the RoHS directive, the interest in bismuth-tin solder alloys—whose melting point around 140°C is very desirable because it allows for the use of lower temperature laminate materials and reduces thermal stress on sensitive components—has only increased as the industry has searched for Pb-free alternatives to the chosen standard, SAC305, which melts at considerably higher temperatures than the incumbent tin-lead alloys.

Top 10 Most-Read SMT007 Articles for March

04/01/2019 | I-Connect007
Starting this month, we will take a look back at the most popular SMT007 news, articles, interviews, and columns over the past 30 days. For the month of March, these are the top 10 most-read SMT007 articles. Check them out.



Copyright © 2019 I-Connect007. All rights reserved.