Anda Technologies USA Unveils New Technology Center


Reading time ( words)

Recently, Abby Tsoi, chief executive officer for Anda Technologies USA Inc., invited the I-Connect007 team to a ribbon-cutting ceremony at their Fremont, California, technology center. Anda designs and manufactures equipment for selective conformal coating, fluid dispensing and plasma treatment. Equipment includes UV/IR curing ovens, conveying equipment, process lines, and complete factory automation solutions for the electronics assembly industry.

RELATED VIDEO


Share

Print


Suggested Items

Dr. Ron Lasky: A Solder Alloy and Solder Paste Overview

06/19/2020 | I-Connect007 Editorial Team
The I-Connect007 editorial team spoke with Dr. Ron Lasky about why the world has not embraced some of the exciting alloys that companies like Indium Corporation have developed. He also provides an overview of solder alloys, including the difficulty of qualifying SAC305.

Case Study: Example of ASKEY Applying QML Validation

04/23/2020 | Edy Yu, I-Connect007
The PCB007 China team paid a visit to the ASKEY plant in Wujiang, Jiangsu, to learn more about their QML process. In this interview with Qixian Zhang, vice GM of ASKEY’s Electronics Product Quality Assurance Department, he discusses what QML means to ASKEY and the electronics industry as a whole.

Process Ionic Contamination Test (PICT) Standard Roundtable With Industry Experts

04/22/2020 | I-Connect007
With standards committees set to release the first of four new test standards, industry experts discussed the process ionic contamination test (PICT) standard, which was recently approved by the IEC for publication. Roundtable participants included Teresa Rowe, senior director of assembly and standards technology at IPC, Graham Naisbitt, chairman and CEO of Gen3, Jason Keeping, corporate process development at Celestica, and Doug Pauls, principal materials and process engineer at Collins Aerospace.



Copyright © 2020 I-Connect007. All rights reserved.