Innovators from NASA, Lockheed Martin Space, and Lenovo to Keynote SMTA International 2019


Reading time ( words)

The SMTA is pleased to announce three inspiring keynote presentations scheduled during SMTA International, September 22-26, 2019 in Rosemont, Illinois, USA.

Adam Steltzner, Ph.D., NASA, will keynote SMTA International the morning of Tuesday, September 24 with his presentation “The Right Kind of Crazy: A True Story of Teamwork, Leadership and High Stakes Innovation.” Adam will share the challenges he faced leading the landing team for NASA’s Curiosity Rover on its mission to Mars. The lessons learned from those struggles illustrate how to better lead high performing teams, manage innovation and drive towards excellence. 

W. Michael Hawes, DSc, Lockheed Martin Space, will deliver his keynote address, “To the Moon and Back—Orion’s Next Jump into Deep Space,” on the morning of Wednesday, September 25. NASA’s Artemis program has a bold charter to land American astronauts, including the first woman and the next man, on the Moon by 2024. To achieve this feat, the Orion spacecraft has been designed, developed and tested by Lockheed Martin to gear up for the next giant leap into deep space. Dr. Mike Hawes will provide a behind-the-scenes look at Orion’s development and technology innovations that empower this next generation spacecraft to take astronauts to explore farther than humankind has ever ventured.

Tadashi Kosuga, distinguished engineer and director, commercial subsystem development, at Lenovo Corporation, will keynote the Low Temperature Solder Symposium on Monday afternoon. This co-located event provides a unique opportunity to engage with a wide array of industry members that are actively expanding their in-depth process knowledge and implementing tin-bismuth based low temperature solders.

Taking place September 22-26, 2019 at the Donald E. Stephens Convention Center in Rosemont, Illinois, the conference features 15 Professional Development Courses, 130 technical papers, and numerous complimentary offerings for engineers and professionals in the electronics manufacturing and assembly industry.

The early registration discount deadline is August 30, 2019. For full details and to register for SMTA International, visit www.smta.org/smtai/.

About SMTA - A Global Association Working at a Local Level 

The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

Share

Print


Suggested Items

High-reliability, Low-temperature Solder Alloys

05/18/2020 | Dr. Pritha Choudhury, MacDermid Alpha Electronics Solutions
Increased digitalization and greater connectivity have been driving miniaturization and more complex and integrated designs in electronics. As the real estate on PCBs shrinks, so does the size of packages. However, the drive for finding design solutions for increased performance has continued to expand. The solder joint is an essential part of assemblies for electronic devices as it provides electrical, thermal, and mechanical connections. Therefore, soldering materials have been evolving to enable such a technological revolution.

This Month in SMT007 Magazine: How Engineers Can Use SPI Tools for Verification

05/06/2020 | Nolan Johnson, I-Connect007
Koh Young’s Ray Welch and Brent Fischthal detail how engineers can work with SPI tools to verify how small they can go in component size with their solder paste application, and how the company’s SPI equipment is helping not only to verify but also to help drive the development collaboration between solder paste and stencil printer manufacturers, and inspection tools and software.

This Month in SMT007 Magazine: Indium Metal Forecast—Supply Chain Strong, Demand Continues to Grow

05/05/2020 | Donna Vareha-Walsh, Indium
Indium is a critical metal for the indium-tin oxide (ITO) market and other coating applications. Donna Vareha Walsh—director of sales and global supply chain and trade compliance at Indium Corporation—describes the plentiful global supply of indium and its recycling loop, examines indium’s history of price volatility and the market reactions from the recent Fanya Metal Exchange auction, and provides an overview of indium supply and demand drivers, as well as the impact of recycling efforts.



Copyright © 2020 I-Connect007. All rights reserved.