Ray Prasad to Hold IPC Tech Ed Webinar Series on BGA and BTC Assembly


Reading time ( words)

With the right design and reflow profile, you are set up to achieve a successful high-yield assembly process. Ray Prasad, Ray Prasad Consultancy Group and IPC Hall of Famer, takes a deep dive into how to achieve low defect rates in his three-part webinar series titled Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly.

The webinar series brings together the latest information on recent/upcoming updates to IPC standards IPC-7095D, Design and Assembly Process Implementation for BGAs; IPC-7093, Design and Assembly Process Implementation of Bottom Termination SMT Components, new revision coming soon; and IPC-7530A, Guidelines for Temperature Profiling for Mass Soldering Processes.

As Chair of the committees developing these standards, Prasad brings critical insight to the importance of the changes to improve industry best practices for assembly.

Key takeaways from the webinar will be:

  • How to properly develop profiles for various soldering processes including reflow, wave, vapor phase, laser and selective soldering
  • Understand the importance of achieving time above liquidus for selected solder alloys and the impact on common assembly defects
  • Overviews of BGA and BTC designs to enable effective high-yield assembly processes
  • Areas to investigate when troubleshooting manufacturing issues with BGAs and BTCs
  • Deep analysis of critical challenges such as voiding, head-on-pillow, pad cratering and more!
  • The live webinar events are scheduled as follows:
  • August 27, 1:00 pm–2:00 pm CDT: Free Introduction Webinar
  • September 19, 1:00 pm–3:00 pm CDT: Part 1: Focus on Bottom Termination Components
  • October 3, 1:00 pm–3:00 pm CDT: Part 2: Focus on Ball Grid Array Challenges

For more information or to register, click here.

Share

Print


Suggested Items

Is Captive Making a Comeback?

12/20/2019 | Andy Shaughnessy, Design007 Magazine
Andy Shaughnessy recently spoke with Altium’s Steve Chalgren, senior VP of business strategy and planning. Steve shared his thoughts about why improved manufacturing and automated EMS equipment, such as robotics, might lead smaller OEMs to become captive shops like the old days. Is captive making a comeback?

LA/Orange County SMTA Expo and Tech Forum Review

12/09/2019 | Dan Feinberg, Technology Editor, I-Connect007
Dan Feinberg recently attended the LA/Orange County SMTA Expo and Tech Forum, which was held in Long Beach, California. He provides an overview of the activities, from the show floor to the presentations.

The Digital Medical Revolution

12/02/2019 | Nolan Johnson, I-Connect007
Zulki Khan, founder and CEO of NexLogic Technologies Inc., offers his unique perspective on manufacturing trends as a PCB turnkey solutions provider based in Silicon Valley. He discusses additional requirements that are now necessary to compete in different industry sectors, most notably medical, which he says is set for a “digital revolution.”



Copyright © 2020 I-Connect007. All rights reserved.