Nordson SELECT to Exhibit at 2019 NEPCON South China Exhibition


Reading time ( words)

Nordson SELECT, a Nordson company, will exhibit its award-winning selective soldering technologies in Booth 1H20 at the upcoming NEPCON South China 2019 exhibition scheduled to take place August 28-29, 2019 at the Shenzhen Convention and Exhibition Center in Shenzhen, China.

On exhibit will be the Cerno 103IL a fully-configured SMEMA compatible selective soldering system equipped with standard features including an automated fiducial location and correction system that provides single click fiducial teach capability, seamless fiducial recognition and true automated alignment and skew correction of a printed circuit board.  Additional standard features of the Cerno® 103IL include high-speed Z-axis motion, dual process viewing cameras and interchangeable solder pots and pumps compatible with tin-lead, lead-free and HMP solder alloys.

In addition to the Cerno 103IL, an In-Line Flux and Preheat Module will be exhibited that can be paired with most Nordson SELECT in-line systems and features concurrent fluxing and preheating that provides significantly increased production throughput and reduces processing time.  The In-Line Flux and Preheat Module is available with atomizing spray flux applicator or precision drop-jet flux dispensers for processing a wide range of various flux chemistries, and topside infrared preheating during fluxing or topside and bottom-side infrared preheat after fluxing with a controlled ramp rate.

Also on display in Booth 1H20 at the Shenzhen Convention and Exhibition Center will be a full range of innovative products from Nordson’s Advanced Technology Systems including Nordson ASYMTEK, Nordson DAGE, Nordson MARCH, Nordson MATRIX and Nordson YESTECH.  This full range of Nordson’s Advanced Technology Systems products includes dispensing and conformal coating systems, X-ray inspection and bondtesting, plasma treatment systems and automated optical inspection systems.

About Nordson SELECT

Nordson SELECT, is a leading worldwide supplier of selective soldering systems including Novo standalone machines offering exceptional value and superior process capability ideal for batch production, Cerno in-line systems delivering uncompromised quality and productivity for demanding soldering applications, and Integra multi-station modular systems designed to meet the most challenging high-volume requirements by combining parallel processing with multiple soldering nozzles for the ultimate in flexibility and maximum throughput. To find out more, visit www.nordsonSELECT.com, or on social media.

About Nordson Corporation

Nordson Corporation engineers, manufactures and markets differentiated products and systems used to dispense, apply and control adhesives, coatings, polymers, sealants, biomaterials, and other fluids, to test and inspect for quality, and to treat and cure surfaces.  These products are supported by application expertise and direct global sales and service.  Nordson serves a wide variety of consumer non-durable, durable and technology end markets including packaging, nonwovens, electronics, medical, appliances, energy, transportation, construction, and general product assembly and finishing.  Founded in 1954 and headquartered in Westlake, Ohio, the company has operations and support offices in nearly 40 countries.  Visit Nordson on the web at http://www.nordson.com.

Share

Print


Suggested Items

Advancement of SPI Tools to Support Industry 4.0 and Package Scaling

08/06/2019 | A. Prasad, L. Pymento, S.R. Aravamudhan, and C. Periasamy, Intel Corp.
This paper evaluates the current state of inline SPI tools from multiple vendors for solder paste measurement accuracy and capability. It discusses a measurement capability analysis that was carried out against a golden metrology tool across a range of volume deposits, and highlights the results from the study.

Practical Implementation of Assembly Processes for Low Melting Point Solder Pastes (Part 2)

07/24/2019 | Adam Murling, Miloš Lazić, and Don Wood, Indium Corporation; and Martin Anselm, Rochester Institute of Technology
In the last three to five years, there has been a resurgence of interest in the use of low melting point alloys for SMT applications. Typically, the compositions are around the eutectic bismuth-tin alloy, perhaps with additions of other elements to increase the robustness of certain alloy properties. Now, there are several new products on the market and numerous ongoing reliability projects in industry consortia.

The Four Things You Need to Know About Test

07/24/2019 | Neil Sharp, JJS Manufacturing
The electronics manufacturing process can often be extremely complex, and the costs associated with product recalls can be astronomical. A robust approach to test is key to ensuring the quality of your product and the satisfaction of your end user.



Copyright © 2019 I-Connect007. All rights reserved.