Nihon Superior to Introduce TipSave N flux-Cored Solder at NEPCON Asia


Reading time ( words)

Nihon Superior Co. Ltd. has announced plans to exhibit in booth #1G08 at the NEPCON ASIA (NEPCON SOUTH CHINA) Show, scheduled to take place August, 28-30, 2019 at the Shenzhen Convention & Exhibition Center in China. The company will celebrate the achievements produced by the well-known SN100C lead-free alloy. TipSave N flux-cored solder wire will be introduced and SN100CVTM P608 D4 solder paste will be shown.

SN100C has been widely accepted as a leading lead-free soldering alloy since it was invented by Nihon Superior’s President Tetsuro Nishimura. The silver-free SN100C alloy delivers a stable microstructure in an alloy that can accommodate the long-term cyclic strains and impact loading to which a solder joint can be subjected. The micro-addition of nickel enhances the performance of SnCu resulting in smooth and bright fillets with few shrinkage defects and a stable microstructure with minimal growth of the interfacial intermetallic, ensuring highly reliable solder joints

The newly developed TipSave N flux cored solder wire extends soldering iron tip life by 3X.  Paired with the (032) no-clean, halogen-free cored-flux, it provides fast wetting and low spattering. TipSave N is a good match for hand soldering as well as continuous robotic soldering as it reduces required soldering tip change overs, increasing production while reducing cost.

SN100CVTM P608 D4 is a completely halogen free, lead-free, no-clean solder paste. Unlike silver-containing alloys that derive their strength from a dispersion of fine particles of eutectic Ag3Sn, SN100CV gains its strength from solute atoms in the tin matrix of the joint. The paste provides excellent wetting and reduces voiding.

Nihon Superior continues to offer solutions to the challenges facing the electronics industry, such as improvements in reliability, thermally stable joining, and lead-free die attach. For more information about Nihon Superior’s new solder pastes and lead-free products, visit us at booth #518.

About Nihon Superior Co., Ltd.

Nihon Superior was founded in 1966 when it began marketing unique flux products imported from the US. The company made its mark on society by gathering the most advanced soldering and brazing technologies and products from around the world, and supplying them to companies in the metal-joining industry. A turning point for the company came when it started developing its own soldering materials and with the success of its unique SN100C lead-free solder alloy Nihon Superior has become a major player in the global market. To support the growing demand for its products, Nihon Superior has established manufacturing and sales centers in Japan, China and other Asian countries, and the United States, and formed business partnerships with companies in other markets.

Share

Print


Suggested Items

Comparing Soldering Results of ENIG and EPIG Post-steam Exposure

09/11/2019 | Jon Bengston and Richard DePoto, Uyemura International USA
Electroless nickel immersion gold (ENIG) is now a well-regarded finish used to enhance and preserve the solderability of copper circuits. Electroless palladium immersion gold (EPIG), meanwhile, is a new surface finish also for enhancing and preserving solderability—but with the advantage of eliminating electroless nickel from the deposit layer. This feature has become increasingly important with the increasing use of high-frequency PCB designs whereby nickel’s magnetic properties are detrimental.

Solder Mask Evolves into a Truly Additive Process

09/09/2019 | John Fix, Taiyo America Inc.
The 5G era is creating quite a bit of work for many PCB engineers as the materials required to keep up with the speed, frequency, and latency requirements need to be defined and qualified. Solder mask, for example, now becomes a truly additive process. Read on to find out how and why.

Selecting the Proper Flex Coverlayer Material

09/06/2019 | Dave Lackey, American Standard Circuits
Coverlayers are polymer materials used to cover and protect the copper traces of the flex circuit product. There are a number of different options available for protecting the circuits, and they serve different design requirements in terms of cost, performance, and flexural endurance optimization. When specifying the choice, it is critical to call out not just the type of coverlayer material but also the thickness requirement. This can be very important in certain types of constructions, especially when a flex circuit will experience dynamic flexing during use.



Copyright © 2019 I-Connect007. All rights reserved.