EVS to Exhibit at SMTAI


Reading time ( words)

EVS International will exhibit in booth #1132 at SMTA International, scheduled to take place Sept. 24-25, 2019 at the Stephens Convention Center in Rosemont, Illinois. The company will show the EVS 500LF solder recovery system. The EVS500 LF offers improved performance and cost savings.

With the EVS500LF, users can quickly recover up to 80% of pure solder with a higher ROI from the waste dross. EVS has continually improved the performance of the EVS units and the new EVS 500LF is no exception.

The EVS 500LF has the same footprint as a printer and is aimed at multiple markets: The customer with one lead wave and one lead-free wave; the customer who uses Nitrogen or wants to reduce their Nitrogen usage; the customer with selective solder pots who only removes small amounts of dross every hour; or the customer with multiple waves where one EVS 500LF is connected to each wave.

For more information about EVS International’s industry-leading systems, visit www.solderrecovery.com.

Share

Print


Suggested Items

Comparing Soldering Results of ENIG and EPIG Post-steam Exposure

09/11/2019 | Jon Bengston and Richard DePoto, Uyemura International USA
Electroless nickel immersion gold (ENIG) is now a well-regarded finish used to enhance and preserve the solderability of copper circuits. Electroless palladium immersion gold (EPIG), meanwhile, is a new surface finish also for enhancing and preserving solderability—but with the advantage of eliminating electroless nickel from the deposit layer. This feature has become increasingly important with the increasing use of high-frequency PCB designs whereby nickel’s magnetic properties are detrimental.

Solder Mask Evolves into a Truly Additive Process

09/09/2019 | John Fix, Taiyo America Inc.
The 5G era is creating quite a bit of work for many PCB engineers as the materials required to keep up with the speed, frequency, and latency requirements need to be defined and qualified. Solder mask, for example, now becomes a truly additive process. Read on to find out how and why.

Selecting the Proper Flex Coverlayer Material

09/06/2019 | Dave Lackey, American Standard Circuits
Coverlayers are polymer materials used to cover and protect the copper traces of the flex circuit product. There are a number of different options available for protecting the circuits, and they serve different design requirements in terms of cost, performance, and flexural endurance optimization. When specifying the choice, it is critical to call out not just the type of coverlayer material but also the thickness requirement. This can be very important in certain types of constructions, especially when a flex circuit will experience dynamic flexing during use.



Copyright © 2019 I-Connect007. All rights reserved.