TRI to Participate in SMTAI 2019


Reading time ( words)

Test Research, Inc. (TRI) will join the 2019 SMTA International Conference and Exhibition held at the Donald E Stephens Convention Center in Rosemont, Illinois to showcase its integrated smart factory test and inspection solutions for the PCBA manufacturing industry. Please visit booth #224 to experience TRI's 3D AOI, 3D SPI and AXI solutions in action. We invite you to also help us celebrate our 30th-anniversary as the test and inspection solutions leader for the electronics manufacturing industry.

Presenting an integrated solution for the PCBA production line, TRI will exhibit our Global Technology Award-winning TR7007QI 3D SPI solution. Furthermore, TRI will showcase our Multi-Angle 3D AOI solution TR7500QE, along with TRI's Automated 3D X-Ray Inspection solution demo. Our expert staff is ready to discuss our entire one-stop solution for ensuring PCBA production quality in a smart factory manufacturing environment.

About TRI 

TRI offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. From 3D Solder Paste Inspection (SPI), 2D and 3D Automated Optical Inspection (AOI), and 3D Automated X-ray Inspection (AXI) systems to Manufacturing Defect Analyzers (MDAs), Functional Testers (FCT) and In-Circuit Testers (ICT), TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing test and inspection requirements. Learn more at http://www.tri.com.tw.  

Share

Print


Suggested Items

Part 12 of Siemens’ Digital Twin Webinar Series: MES and Enterprise Systems

11/25/2020 | I-Connect007 Editorial Team
I-007e Micro Webinars recently released a free, on-demand series titled “Implementing Digital Twin Best Practices From Design Through Manufacturing” with Siemens' Jay Gorajia. To conclude the series, in Part 12, Gorajia discusses, “Integrating Valor Solutions as Part of MES and Enterprise Systems."

Part 11 of Siemens’ Digital Twin Webinar Series: Data-Driven Manufacturing

11/18/2020 | I-Connect007 Editorial Team
I-007e Micro Webinars recently released a free, on-demand series titled “Implementing Digital Twin Best Practices From Design Through Manufacturing” with Siemens' Jay Gorajia. In Part 11, Gorajia discusses, “Data-Driven Manufacturing: Making Big Data Into Smart Data.”

Part 10 of Siemens’ Digital Twin Webinar Series: Inventory Management

11/11/2020 | I-Connect007 Editorial Team
I-007e Micro Webinars recently released a free, on-demand series titled “Implementing Digital Twin Best Practices From Design Through Manufacturing” with Siemens' Jay Gorajia. In Part 10, Gorajia looks at “Inventory Management in the Warehouse and on the Shop Floor.” Material accounts for 80% of PCB assembly costs. If not managed correctly, margins can be cut even further.



Copyright © 2020 I-Connect007. All rights reserved.