Indium Features WS-446HF Flip-Chip and Ball-Attach Flux at SEMICON Taiwan


Reading time ( words)

Indium Corporation will feature its WS-446HF Flux for both flip-chip and ball-attach processes at SEMICON Taiwan 2019, September 18-20, in Taipei, Taiwan.

WS-446HF flux is a robust, NIA (no intentionally added), halogen-free, water-wash flux that is designed to provide one simple solution to complicated applications, especially those with a single cleaning step for both BGA ball-attach and flip-chip processes. It has a powerful activator system to promote good wetting on even the most demanding substrate metalizations, such as Cu OSP, ENEPIG, and ENIG. WS-446HF helps to improve production yield by minimizing non-wet open defects, missing balls, and eliminating Electro-Chemical Migration (ECM).

WS-446HF:

  • Promotes excellent solderability and wetting on a wide range of surfaces
  • Cleans well with room temperature DI water            
  • Eliminates ECM or dendrite formation caused by residue

Indium Corporation has an industry-proven portfolio of products that meet the current and evolving challenges encountered in fine-pitch SiP and Heterogeneous Integration applications. For more information on Indium Corporation’s materials for SiP, visit www.indium.com/SiP or visit Indium Corporation’s booth #J2440.

About Indium Corporation

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com.

Share

Print


Suggested Items

The Convergence of 5G and Automotive

01/08/2020 | Barry Matties, I-Connect007
Karthik Vijay is head of the applications engineering team for customers in Europe at Indium Corporation. He spoke with Barry Matties about what EMS or assemblers for automotive should consider, as well as how he thinks 5G will affect the marketplace and manufacturing.

Indium Discusses New Materials and Plans for 2020

12/10/2019 | Real Time with...productronica
Editor Nolan Johnson sits down with Nash and Mackie to discuss Indium’s focus on creating innovative products for the 5G, automotive, semiconductor, and high-reliability segments. Mackie offers a preview of Indium’s plans for 2020 and beyond, including lead-free drop-in sintering materials that can be dispensed and printed more quickly than ever before.

LA/Orange County SMTA Expo and Tech Forum Review

12/09/2019 | Dan Feinberg, Technology Editor, I-Connect007
Dan Feinberg recently attended the LA/Orange County SMTA Expo and Tech Forum, which was held in Long Beach, California. He provides an overview of the activities, from the show floor to the presentations.



Copyright © 2020 I-Connect007. All rights reserved.