Indium Features WS-446HF Flip-Chip and Ball-Attach Flux at SEMICON Taiwan


Reading time ( words)

Indium Corporation will feature its WS-446HF Flux for both flip-chip and ball-attach processes at SEMICON Taiwan 2019, September 18-20, in Taipei, Taiwan.

WS-446HF flux is a robust, NIA (no intentionally added), halogen-free, water-wash flux that is designed to provide one simple solution to complicated applications, especially those with a single cleaning step for both BGA ball-attach and flip-chip processes. It has a powerful activator system to promote good wetting on even the most demanding substrate metalizations, such as Cu OSP, ENEPIG, and ENIG. WS-446HF helps to improve production yield by minimizing non-wet open defects, missing balls, and eliminating Electro-Chemical Migration (ECM).

WS-446HF:

  • Promotes excellent solderability and wetting on a wide range of surfaces
  • Cleans well with room temperature DI water            
  • Eliminates ECM or dendrite formation caused by residue

Indium Corporation has an industry-proven portfolio of products that meet the current and evolving challenges encountered in fine-pitch SiP and Heterogeneous Integration applications. For more information on Indium Corporation’s materials for SiP, visit www.indium.com/SiP or visit Indium Corporation’s booth #J2440.

About Indium Corporation

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com.

Share

Print


Suggested Items

IPC Electronics Materials Forum 2019

10/16/2019 | IPC
IPC will be holding its Electronics Materials Forum 2019 from November 5–7, 2019, in Bloomington, Minnesota. The Electronics Materials Forum is a new technical conference focused on developments in materials and processes associated with advanced electronics assembly and manufacturing.

Meet Chris Ellis, SMT007 Columnist

09/18/2019 | I-Connect007
Meet Chris Ellis, one of our newest SMT007 columnists! In his columns, Ellis addresses common problems that Manncorp customers have had with the in-house conversion process, and shares solutions that have worked in the past.

PCB Design Training: More Critical Than Ever

09/05/2019 | Andy Shaughnessy, Design007 Magazine
I interviewed Gary Ferrari of FTG at the IPC High-Reliability Forum and Microvia Summit in Baltimore. Gary is a co-founder of the IPC Designers Council and a longtime advocate for PCB design and PCB designers. We discussed the crucial role that PCB designers play in the entire electronics development process, and how IPC and the Designers Council are helping to educate and inform the next generation of designers.



Copyright © 2019 I-Connect007. All rights reserved.