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Four Indium Corporation experts will present at SMTA International, September 22-26, in Rosemont, Illinois, USA.
Dr. Ning-Cheng Lee, Vice President of Technology, will lead a professional workshop on Novel Fluxes with Decreased Viscosity After Reflow for Flip-Chip and SiP Assembly. He will explain the development of fluxes for flip-chip and SiP assembly. These high-viscosity, high-tack fluxes are designed to be used to secure components at the placement and reflow stage allowing the flux residue to be cleaned.
Dr. Lee will also present Fluxes Designed for Suppressing Non-Wet-Open during BGA Assembly, which examines the increasing severity of warpage and non-wet-open (NWO) defects during BGA assembly due to the continuing advancement of miniaturization. He will discuss how a “cold-welding barrier” method utilizing a flux coating has been developed to suppress NWO defects.
Additionally, Dr. Lee will lead the professional development course, Achieving High-Reliability for Lead-Free Solder Joints – Materials Consideration. The goal of this course is to provide participants with the understanding of how various factors contribute to failure modes, and how to select proper solder alloys and surface finishes for achieving high-reliability.
Kenneth Thum, Senior Technical Support Engineer, will present Ultrafine Solder Paste Dispensing for Heterogeneous Integration. The paper examines how heterogeneous integration for advanced packaging is driving the need for ultrafine solder paste dispensing in tightly packed components where printing is not possible. Thum will offer solutions on how to achieve consistent fine-dot printing, including examining different dispensing equipment technologies and important solder paste characteristics.
Indium Corporation experts will also co-chair two sessions during the conference:
Adam Murling, Technical Support Engineer, Global Accounts, will chair a Manufacturing Excellence Track session on Stencils & Printing.
Tim Jensen, Product Manager for Engineered Solder Materials, will co-chair an Advanced Packaging Technology Track session on Advanced Packaging.
Dr. Lee is a world-renowned soldering expert, an SMTA Member of Distinction, and IEEE Fellow. He has more than three decades in the development of fluxes, alloys and solder pastes for SMT industries and extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. In addition to SMT and semiconductor soldering materials, his research also extends to nanobonding technology and thermal conductive materials. Dr. Lee has published articles in numerous industry publications and is frequently an invited speaker for presentations, seminars, keynote speeches, and short courses worldwide, many of which have been recognized with “Best of Conference” awards.
Thum provides technical support and process troubleshooting expertise to Indium Corporation’s customers. His experience involves delivering yield improvements and enhanced supplier quality. Thum earned his bachelor’s degree in computer-aided design and computer-aided manufacturing from the University of Malaya. Additionally, he is an SMTA-certified process engineer.
Murling is responsible for providing leading-edge technical support for Indium Corporation’s global account initiatives through SMT process optimization, material recommendations, and customer training. He is an active blogger and has authored numerous technical papers. He earned his bachelor’s degree in chemical engineering from Clarkson University.
Jensen is an SMTA-certified process engineer. He has more than 20 years of experience working with customers troubleshooting and optimizing SMT process lines and solving defects, such as head-in-pillow, graping, and QFN voiding. Jensen has worked directly on hundreds of surface mount lines and developed a number of different products. Using that direct knowledge and expertise, he works closely with Indium Corporation’s technical service, sales, and research and development teams to develop cutting-edge products that address the unique challenges faced by the electronics assembly industry. As a senior product manager, Jensen is responsible for Indium Corporation’s most diverse product group, which includes solder preforms, wire, ribbon and foil, as well as thermal interface materials. He earned his bachelor’s degree in chemical engineering from Clarkson University and his master’s in business administration from Syracuse University.
About Indium Corporation
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com.