Murray Percival Company to Support MIRTEC’s AOI at SMTAI


Reading time ( words)

Murray Percival Company, the leading supplier to the Midwest's electronics industry, is pleased to announce that they will be available to demo the MIRTEC MV-6 OMNI 3D AOI machine* at booth #305 at SMTA International, scheduled to take place September 24-25, 2019 at the Donald Stephens Convention Center in Rosemont, Illinois.

The all new MV-6 OMNI 3D AOI machine combines MIRTEC’s exclusive 15 Mega Pixel CoaXPress camera technology with their proprietary OMNI-VISION® 3D Digital Tri-Frequency moiré technology to provide precision inspection of SMT devices on finished PCB assemblies.

MIRTEC’s exclusive 15 Mega Pixel CoaXPress camera system is designed and manufactured by MIRTEC for use with its complete product range of inspection equipment.

MIRTEC’s proprietary Digital Tri-Frequency moiré technology, provides superior 3D inspection of SMT and through-hole devices up to 25mm tall. This industry acclaimed technology yields precise height measurement data used to detect lifted component and lifted lead defects as well as solder volume post reflow. Fully configured, the new MIRTEC MV-6 OMNI machines feature four (4) 10 Mega Pixel side-view cameras in addition to the 15 Mega Pixel top-down camera. There is little doubt that this new technology has set the standard by which all other inspection equipment are measured.

 About Murray Percival

The Murray Percival Company is a third-generation family owned business that was founded in January of 1960. They are currently the leading supplier to the Midwest's electronics industry, offering thousands of capital and distribution products as well as being the industry’s leading process enabler. www.murraypercival.com

Share

Print


Suggested Items

SMTA Europe Webinar: What Is a Good Solder Joint, and How Can Solder Joints Be Tested?

11/18/2020 | Pete Starkey, I-Connect007
What is a good solder joint? And how can they be tested not only for purposes of process characterisation, optimisation, monitoring, and control but also for ensuring their long-term reliability? Pete Starkey details a webinar organised by the Europe Chapter of SMTA that was presented by Bob Willis, an expert in soldering, assembly technologies, and failure analysis.

This Month in SMT007 Magazine: Test and Measurement in a Smart Factory

11/03/2020 | Nolan Johnson, I-Connect007
Nolan Johnson spoke with MIRTEC President Brian D’Amico about how the role of test and measurement equipment is changing in the smart factory and how shops can adjust to make use of the new technology. D’Amico shares this insight: “While approximately 90% of U.S. electronics manufacturers recognize the potential of Industry 4.0 to improve productivity, many are slow to adopt smart factory solutions within the manufacturing process.”

Reducing Flux Splatter in Sensors and Camera Modules

10/30/2020 | Jasbir Bath, Shantanu Joshi, and Noriyoshi Uchida, Koki Solder America And Koki Company Limited
With the increased use of electronics in new technology areas, flux formulations are being developed to address the new and existing requirements. For sensors and camera modules used for Advanced Driver Assistance System (ADAS) and internet of things (IoT) applications, there is a demand for no-clean flux formulations in lead-free solder paste, which can reduce flux splattering during reflow.



Copyright © 2020 I-Connect007. All rights reserved.