Koh Young America to Highlight 3D Inspection Solutions for the Smart Factory at SMTAI


Reading time ( words)

Koh Young America will highlight its industry-leading Full 3D inspection solutions and next-generation closed-loop Koh Young Process Optimizer (KPO) at SMTA International on September 24-25 in Rosemont, Illinois. The company cordially invites show and conference attendees to visit booth 609 and learn how industry-leading 3D measurement systems and closed-loop process solutions from Koh Young America can help improve production throughput and yield.

At the show, Koh Young America will demonstrate the industry’s fastest true 3D measurement and inspection solution. The 8030-3 Solder Paste Inspection (SPI) solution and analytics to eliminate false calls and boost throughput. We will also highlight our flagship aSPIre3 with a feature set suitable for myriad challenges in demanding production environments in-line at booth 823 with Fuji America. These systems continue to raise the benchmark standards in the industry.

KY_3DAOI_Zenith_system.jpgThe award-winning Koh Young Zenith Automated Optical Inspection (AOI) solution will complement the revolutionary SPI equipment. Consisting of multiple models targeting different production needs, Koh Young will highlight the Zenith platform – the world’s best-selling and first True 3D AOI. The hardware technology and measurement algorithms within the Zenith series work together to identify defect sources and provide accurate inspection of components, joints, and more, regardless of the model.

KY-P3 M3_6.jpgUsing its world-class 3D AOI measurement technology as the foundation, Koh Young designed the KY-P3 to overcome longstanding industry challenges with automated pin inspection. Combining its advanced high-resolution optics with innovative vision algorithms, the Koh Young KY-P3 provides accurate pin inspection for single pin, array, forked, press-fit, and other pin arrangements. Following its vision to “Measure Everything, Everywhere,” the new Koh Young KY-P3 delivers true 3D inspection capabilities for automotive, industrial, and other verticals, including backplanes and connector assembly processes.

Ksmart_The true smart factory solution.jpg

Smart Factory Solution

Koh Young is leading the effort to harness the power of connectivity and create a smart factory. For instance, its Koh Young Process Optimizer (KPO), which is using AI-powered machine learning, includes interlinking software modules that exercise complex algorithms to develop closed-loop process recommendations. The Machine-to-Machine (M2M) connectivity drives the smart factory vision one step further by enabling automatic SMT line adjustments. Finally, working with its printer and mounter partners, Koh Young has developed the connectivity

tools to connect with multiple suppliers and simplify communication across the entire PCBA line. In fact, Koh Young was named one of the 10 Most Innovative Smart Factory Solution Providers to Watch in 2019 and earned a position in “Headlines 500”, an annual list of the fastest-growing U.S. companies. As the recognized leader in electronics measurement and inspection, Koh Young continues to expand its capabilities to solve industry challenges and improve the measurement industry.

If you cannot attend SMTA International and visit us in Booth 609, you can learn more about Koh Young and its best-in-class inspection solutions at www.kohyoung.com.

About Koh Young

Koh Young Technology Inc., the leading 3D measurement-based inspection equipment and solutions provider, performs an essential role for quality control and process optimization across a growing set of industries including printed circuit board assembly, machining and assembly process manufacturing, semiconductor manufacturing, and various medical fields. In addition to its corporate headquarters in Seoul, Koh Young has sales and support offices in Germany, Japan, Singapore, China, Mexico, and the United States. These local facilities ensure it sustains a close relationship with its growing customer base, while providing them with access to a global network of inspection and measurement experts.

Share

Print


Suggested Items

Comparing Soldering Results of ENIG and EPIG Post-steam Exposure

09/11/2019 | Jon Bengston and Richard DePoto, Uyemura International USA
Electroless nickel immersion gold (ENIG) is now a well-regarded finish used to enhance and preserve the solderability of copper circuits. Electroless palladium immersion gold (EPIG), meanwhile, is a new surface finish also for enhancing and preserving solderability—but with the advantage of eliminating electroless nickel from the deposit layer. This feature has become increasingly important with the increasing use of high-frequency PCB designs whereby nickel’s magnetic properties are detrimental.

Solder Mask Evolves into a Truly Additive Process

09/09/2019 | John Fix, Taiyo America Inc.
The 5G era is creating quite a bit of work for many PCB engineers as the materials required to keep up with the speed, frequency, and latency requirements need to be defined and qualified. Solder mask, for example, now becomes a truly additive process. Read on to find out how and why.

Selecting the Proper Flex Coverlayer Material

09/06/2019 | Dave Lackey, American Standard Circuits
Coverlayers are polymer materials used to cover and protect the copper traces of the flex circuit product. There are a number of different options available for protecting the circuits, and they serve different design requirements in terms of cost, performance, and flexural endurance optimization. When specifying the choice, it is critical to call out not just the type of coverlayer material but also the thickness requirement. This can be very important in certain types of constructions, especially when a flex circuit will experience dynamic flexing during use.



Copyright © 2019 I-Connect007. All rights reserved.