Indium’s Graham Wilson to Present at EMPC 2019


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Indium Corporation expert Graham Wilson, applications engineer, will share his industry expertise at the 22nd European Microelectronics and Packaging Conference, September 16-19, in Pisa, Italy.

Wilson’s presentation, Substrate to Baseplate Attach: A Novel Solder Solution with an Embedded Metal Matrix for Enhanced Reliability, discusses the importance of strong, uniform bondline control between the power device and substrate to achieve high mechanical reliability. This is especially important due to power electronics’ changing requirements for functional reliability, particularly in automotive markets. Wilson also examines how Indium Corporation’s InFORMS® technology provides a stable and reliable drop-in solution.

Wilson is an applications engineer for Indium Corporation’s European operations. He provides comprehensive technical advice in the selection, use, and application of solder paste, flux, and engineered solders to customers in electronics assembly, optoelectronics, thermal management, semiconductor packaging, and related industries. Wilson has more than 20 years of experience spanning a number of industries, including a focus on electronics assembly and thermal management. He is certified as a Six Sigma Green Belt through the Thayer School of Engineering at Dartmouth and shares his expertise at conferences internationally. Wilson earned his degree in HNC Electronics from the University of Northampton.

About Indium Corporation

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

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