Indium to Feature Solder Paste at SiP Conference China 2019


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Indium Corporation will feature its proven Indium3.2HF solder paste for fine-pitch printing at SiP Conference China 2019, September 10-11, in Shenzhen, China.

Indium Corporation’s Indium3.2HF is a water-soluble, halogen-free, Pb-free solder paste specifically formulated with fine-pitch powders for fine-feature printing applications. Indium3.2HF offers consistent, repeatable printing performance, combined with a long stencil life. In addition to a proven track record that includes use in more than 2 billion mobile FEM modules, Indium3.2HF delivers:

  • Good response-to-pause
  • A wide reflow profile window
  • Outstanding slump resistance
  • Excellent wetting capability
  • Superior fine-pitch soldering ability
  • Water-washable flux residue

From water-soluble solder pastes to ultra-low residue, no-clean fluxes, Indium Corporation has an industry-proven portfolio of products that meet the current and evolving challenges encountered in fine-pitch SiP applications. For more information on Indium Corporation’s materials for SiP or Indium3.2HF Solder Paste, visit www.indium.com/SiP

About Indium Corporation

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

 

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