-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
The Cost of Rework
In this issue, we investigate rework's current state of the art. What are the root causes and how are they resolved? What is the financial impact of rework, and is it possible to eliminate it entirely without sacrificing your yields?
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
IPC CEMAC 2019 Showcases Intelligent Future Driven by Data
August 30, 2019 | IPCEstimated reading time: 1 minute
More than 200 representatives from companies such as Huawei, CRRC, NASA, Foxconn, Vayo and JWI Software gathered in Shenzhen, China for IPC CEMAC 2019. This year’s theme, “Intelligent Future Driven by Data,” provided attendees insight into Industry 4.0, the Internet of Things (IoT), electronic component 3D digital design, the use of data to drive intelligent manufacturing and the demand for high quality/highly reliable products.
Peter Chiang, vice president, IPC Greater China, opened the annual members-only event, with an introduction to the implementation of Industry 4.0 and release of IPC-2591, IPC’s connected factory exchange standard. Huang Chunguang, Huawei Technologies, Co. Ltd., discussed the important role of 3D digitalization of electronics components during his presentation, “Software Defines Manufacturing, Data Drives the Future.” Luo Jiapeng, Foxconn, introduced Foxconn’s SMT Industrial Internet blueprint and framework during his presentation, “Data -- the Foundation of Intelligent Manufacturing.”
In addition, presentations were given by: Bhanu Sood, Ph.D., NASA Goddard Space Flight Center; Chen Zhiman, CRRC Times Electric; Johnsson Per Anders, JWI Software; Liu Fengshou, Vayo; and Du Yunliang, Mentor Graphics – a subsidiary of Siemens. The event provided ample time for professionals from various industries including aerospace, railway, telecommunication and electronics manufacturing to network with speakers.
“China accounts for up to 38 percent of the global electronics industry production capacity of nearly 2 trillion USD,” said David Bergman, IPC vice president, standards and training. “The rapidly growing Chinese electronics industry market share creates opportunities and challenges for domestic electronics-related enterprises. As a global electronics industry association, IPC is committed to the promotion of technical exchanges and providing enterprises with the latest technical standards and training to drive further development of the industry. IPC’s annual CEMAC event provides the perfect backdrop for these technical exchanges.”
Next year’s IPC CEMAC will be located in Shanghai. For more information about this event or other IPC-sponsored events in Asia Pacific, visit www.ipc.org.cn.
Suggested Items
IMI Taps New Opportunities to Sustain Grit in China
03/28/2024 | IMIIntegrated Micro-Electronics, Inc. (IMI), Joey S. Bantatua, IMI China’s head of operations and general manager was recently interviewed by Asia Electronics Industry (AEI) magazine where he talked about the prospects of the country both as a market and a production hub.
Kimball Electronics Publishes Annual Sustainability Disclosures with its 2023 Guiding Principles Report
03/28/2024 | BUSINESS WIREKimball Electronics, Inc. published its annual sustainability disclosures in its 2023 Guiding Principles Report, themed “How We Are Winning Together The Kimball Way.”
iNEMI Webinar: Humidity Robustness and Insulation Coordination for e-Mobility
03/27/2024 | iNEMIThis webinar is a follow-up to the recent Seminar on Humidity Robustness and Insulation Coordination for e-Mobility, organized by iNEMI and ZESTRON Europe and supported by the ECPE.
Electronics Industry Sentiment Rises in March
03/27/2024 | IPCIPC releases March 2024 Global Sentiment of the Electronics Supply Chain Report
Mycronic to Showcase More Versatile, High-productivity Assembly Solutions at IPC APEX EXPO 2024
03/27/2024 | MycronicMycronic, the leading Sweden-based electronics assembly solutions provider, will continue to respond to growing customer demand for high-flexibility, high-productivity solutions for zero-defect PCB assembly at IPC APEX EXPO 2024 in Anaheim, CA on April 9 - 11.