Laserssel to Highlight Advanced LSR Technology at SMTAI 2019


Reading time ( words)

Laserssel will exhibit in booth #1109 at SMTA International, scheduled to take place September 24-25, 2019 at the Donald Stephens Convention Center in Rosemont, Illinois.

“I look forward to attending the exhibition and talking to as many people as I can about our LSR technology,” commented Denis Barbini, Ph.D, Managing Director of the USA for Laserssel. “SMTA International is a highly attended show and I invite anyone with the desire to reduce their typical reflow oven’s 8-minute cycle down to just 10 seconds to stop by booth #1109 at the show!”

Laser Selective Reflow (LSR) is designed to deliver a uniform, defocused laser beam over a specifically tailored area on a PCB. The uniform defocused beam is controlled and delivered to the product via the BSOM (Beam Shaping Optic Module system) on user defined area. This unique feature permits the user to implement novel soldering solutions not possible with conventional techniques.  It also allows the selective application of energy to locations that require soldering while not heating up potentially thermally sensitive areas. LSR is potentially a means to also mitigate or even eliminate the warpage of various packages. It provides a reliable, robust, high yielding and fast, only 1~6 seconds laser soldering time per selected area. It is made possible by highly uniform optic system and distinctive recipe developed by Laserssel.

To learn more about Laserssel, please visit the company at Booth #1109 at SMTA International.

About Laserssel

Laserssel Corporation is a leading provider of laser selective soldering technology supporting global semi-conductor, automotive, consumer, communications, military and industrial segments. As a pioneer in selective soldering segments, Laserssel has provided customers with unique soldering capabilities to allow to solder on heat sensitive substrates that were considered to be impossible to reflow. Laserssel is now expanding its product offerings in advanced packaging, plastic and organic substrates, very thin substrates with concern of warpage and any other challenges that were difficult, if not impossible, in conventional reflow process. Combined with its extensive knowledge in laser technology and expertise in process technology, Laserssel is well positioned to help customers to solve problems in the space of packaging and assembling the next generation of electronic devices.  Please visit www.laserssel.com for more information.

Share

Print


Suggested Items

Discover the Benefits of a Technology Center

10/23/2019 | Barry Matties, I-Connect007
Nico Fahrner, application engineer at Rehm Thermal Systems, talks with Barry Matties about the benefits prospective customers get from being able to fully test their systems in-line at Rehm’s technology centers before purchasing.

Solder Mask Evolves into a Truly Additive Process

09/09/2019 | John Fix, Taiyo America Inc.
The 5G era is creating quite a bit of work for many PCB engineers as the materials required to keep up with the speed, frequency, and latency requirements need to be defined and qualified. Solder mask, for example, now becomes a truly additive process. Read on to find out how and why.

Recent Advances in X-ray Technology: SMTA Webinar Recap

08/12/2019 | Pete Starkey, I-Connect007
Technical Editor Pete Starkey recently attended a webinar on advances in X-ray technology and its applications in the electronics industry, as presented by Keith Bryant, Chair of SMTA Europe, on behalf of SMTA India. Here are the highlights of the webinar.



Copyright © 2019 I-Connect007. All rights reserved.