MacDermid Alpha‘s Assembly Division to Present Void Reduction Solutions at the FED Conference


Reading time ( words)

The Assembly division of MacDermid Alpha Electronics Solutions, a world leader in the production of electronics soldering and bonding materials, will present on the topic of Void Reduction at the FED Conference which runs from 26-27 September in Bremen, Germany.

Ralph Christ, customer technical support manager DACH Region for MacDermid Alpha will present "Voiding in Solder Joints: Identifying Causes and Potential Actions Against Void Formation" on Thursday 26 September, 15.30 at the event. "Voids are a major concern for electronic assembly manufacturers as voiding often compromises the reliability of an assembly," comments Ralph. "To combat voiding a combination of process expertise to understand critical process parameters, design factors and equipment information and innovative products such as solder paste, solder preforms and stencil design is needed."

ALPHA Void Reduction Solutions is a proven methodology to address all types of voiding issues in SMT assembly. Alpha experts analyze a customer’s process and develop an engineered recommendation addressing material sets, equipment settings and stencil design strategies to produce the desired voiding levels.

MacDermid Alpha Automotive will also present at the conference. Jan-Henryk Serzisko, strategic account director for MacDermid Alpha Automotive will present "Formable Electronics: Process Requirements and Materials for IMSE" on Friday 27 September at 15:00.

To register for the event please visit the FED Conference website. To learn more about ALPHA Void Reduction Solutions and ALPHA Products for Formable Electronics visit www.macdermidalpha.com.

About MacDermid Alpha Electronics Solutions

Through the innovation of specialty chemicals and materials under our Alpha, Compugraphics, and MacDermid Enthone brands, MacDermid Alpha Electronics Solutions provides solutions that power electronics interconnection.  We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain.  The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients. Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time. Find out more at MacDermidAlpha.com.

Share

Print


Suggested Items

This Month in SMT007 Magazine—Electronics Manufacturing: A Critical Industry and Supply Chain

07/01/2020 | I-Connect007 Editorial Team
Chris Peters represents the U.S. Partnership for Assured Electronics, where he advocates for electronics manufacturing as a critical industry. Here, he describes the current status, the supply chain, and what he sees in Washington D.C.

The iNEMI 2019 Board Assembly Roadmap

06/01/2020 | Pete Starkey, I-Connect007
iNEMI continues to publish chapters of its 2019 Roadmap and recently presented an overview of its Board Assembly Roadmap Chapter in a webinar prefaced by Grace O’Malley, vice president of global operations. The new chapter is just the latest addition to this global effort from 23 working groups contributing expert input from all aspects of the electronics industry.

Ross Berntson: Indium Corporation’s Pledge for Safe Resumption Post-COVID

05/22/2020 | Nolan Johnson, I-Connect007
On May 20, Nolan Johnson spoke with Ross Berntson, Indium Corporation’s president and COO, about the company’s response to the COVID-19 outbreak. Berntson details the company's work with a consortium of manufacturing businesses in central New York state, developing a manufacturing pledge to keep people safe and keep factories running. Indium Corporation has been one of the frontrunners in formalizing such procedures and in sharing lessons learned among all the participating companies.



Copyright © 2020 I-Connect007. All rights reserved.