Seika: Meet with FLITE Ambassadors at SMTAI


Reading time ( words)

Female Leaders in Tech, Everywhere (FLITE) ambassadors will be meeting at the WNIE booth during SMTA International on Wednesday, September 25, 2019 at 3:15 p.m. during the wine reception. Attendees are invited to bring their drinks and appetizers and meet with Ambassadors, Claire Saunders, Sherry Stepp and Michelle Ogihara. The booth will also be open all day on Wednesday to receive inquiries on FLITE.

Attendees at SMTA International who are interested in learning more about FLITE are invited to attend. FLITE organizes events, publishes articles, blogs and promotional pieces to ensure that members are kept up-to-date with influential and inspirational females, with the shared goal of empowering women in tech now and in future generations.

For more information, visit www.weareflite.com or register at https://www.linkedin.com/groups/12000393.

For more information about FLITE, U.S., contact Michelle Ogihara at michelle@weareflite.com. or visit www.seikausa.com.

About FLITE

Through our knowledge network, females come together to: lead the conversation, connect with a common community, share best practice, success stories, achievements and mentor other ambitious females entering the tech world.

FLITE organizes events, publishes articles, blogs and promotional pieces to ensure that members are kept up-to-date with influential and inspirational females, with the shared goal of empowering women in tech now and in future generations. For more information, visit www.weareflite.com or register at https://www.linkedin.com/groups/12000393.

About Seika Machinery, Inc.

Seika Machinery, Inc. (SMI) is a subsidiary of Seika Corporation, Japan and member of the Mitsubishi Global Group. SMI provides electronics manufacturers with advanced machinery, superior materials and engineering services.

Share

Print


Suggested Items

IPC Electronics Materials Forum 2019

10/16/2019 | IPC
IPC will be holding its Electronics Materials Forum 2019 from November 5–7, 2019, in Bloomington, Minnesota. The Electronics Materials Forum is a new technical conference focused on developments in materials and processes associated with advanced electronics assembly and manufacturing.

The Convergence: IPC Merging CFX With IPC-2581

09/16/2019 | Andy Shaughnessy, I-Connect007
Gary Carter of XPLM and Michael Ford of Aegis Software are heading a group tasked with combining the IPC-2581 standard, now referred to as Digital Product Model Exchange (DPMX), with IPC’s Connected Factory Exchange (CFX). In this interview, they discuss the benefits that can be expected when these standards are fully merged for both PCB designers and process engineers on the manufacturing floor.

Communication and Information: Two Keys to Success

05/21/2019 | Nolan Johnson, I-Connect007
Nolan Johnson and Duane Benson, an I-Connect007 columnist and a representative from Milwaukee Electronics, discuss how assemblers can help their customers through submitting and maintaining accurate information, and engaging in open communication early and often about the highly important bill of materials.



Copyright © 2019 I-Connect007. All rights reserved.