ZESTRON’s Michael Kövi to Present at SMTAI 2019

Reading time ( words)

ZESTRON has announced that Michael Kövi, application engineer, ZESTRON Europe, will be presenting “Handling Technical Cleanliness in Electronic Production” at SMTA International. Kövi’s presentation will be on Thursday, September 26, during session MFX7 – Cleaning: Challenges.

Technical cleanliness primarily measures the presence or absence of particles on electronic components and parts within industrial manufacturing processes. The presence of electrically conductive particles on components can impact the production process or the proper operation of the component or PCB. Conductive particles may cause PCB failure by connecting contacts on a circuit board and causing a short circuit event. Even barring a direct connection between contacts, a conductive particle between two contacts that do not touch can cause an electrical breakdown or tracking as a result of reducing the air gap and creepage distance.

Filter membranes are used to extract particles that are inspected to quantify contaminants that may affect the performance, lifetime, and reliability of final products.

This paper provides overviews of the latest developments in standardization, implications for adopting a technical cleanliness approach, monitoring and validation procedures, and a brief introduction to risk assessment of particle contamination.

Visit ZESTRON at booth #623, or please click here to schedule an appointment, for further discussion on Technical Cleanliness or other cleaning application needs. Event registration is through SMTA.


ZESTRON is headquartered in Manassas, Virginia and operates in more than 35 countries. With eight technical centers worldwide and the industry’s most knowledgeable team of engineers focused on high precision cleaning, ZESTRON’s commitment to ensuring that its customers surpass even the most stringent cleaning requirements is without equal.

For additional information or to tour one of our technical centers, please visit www.zestron.com.



Suggested Items

The iNEMI 2019 Board Assembly Roadmap

06/01/2020 | Pete Starkey, I-Connect007
iNEMI continues to publish chapters of its 2019 Roadmap and recently presented an overview of its Board Assembly Roadmap Chapter in a webinar prefaced by Grace O’Malley, vice president of global operations. The new chapter is just the latest addition to this global effort from 23 working groups contributing expert input from all aspects of the electronics industry.

One Fish, Two Fish, Red Fish, Blue Fish: Same Industry, New Look

05/22/2020 | I-Connect007 Research Team
Learning a lesson from challenges is one thing, but implementing changes based on those lessons is quite another. I-Connect007 regularly surveys leaders in the electronics industry to bring you important and relevant information that helps you make better decisions. What lessons have you learned during the COVID-19 crisis, and what changes have you made?

Process Ionic Contamination Test (PICT) Standard Roundtable With Industry Experts

04/22/2020 | I-Connect007
With standards committees set to release the first of four new test standards, industry experts discussed the process ionic contamination test (PICT) standard, which was recently approved by the IEC for publication. Roundtable participants included Teresa Rowe, senior director of assembly and standards technology at IPC, Graham Naisbitt, chairman and CEO of Gen3, Jason Keeping, corporate process development at Celestica, and Doug Pauls, principal materials and process engineer at Collins Aerospace.

Copyright © 2020 I-Connect007. All rights reserved.