Nordson DAGE Joins UK Consortium to Develop Test & Inspection for Battery Manufacturing

Reading time ( words)

Nordson DAGE, a division of the Nordson Corporation is delighted to announce its success in joining a group of leading UK companies, including Williams Manufacturing Group and Unipart, to advance the UK’s low-carbon automotive capabilities. As part of the UK government’s Industrial Strategy, five projects totaling £33M were awarded through the advanced propulsion centre (APC).

As part of the “H1perChain” consortium, Nordson DAGE will now embark on a three-year project to scale up the UK’s battery pack manufacturing capabilities. The project will aim to reduce battery pack costs while making a step change in manufacturing volumes. Key to achieving this task is developing new test and inspection processes to ensure best-in-class reliability on each battery pack.

Nordson will deploy its Bond Test, X-ray and automated optical inspection products into the project, while collaborating closely with the R&D centers of the other consortium members. The Nordson DAGE Test and Inspection Center of Excellence, based in Aylesbury UK, will play a pivotal role throughout the project. There is significant focus on Industry 4.0 digitalization which plays to a core research focus for Nordson, who already have a full portfolio of test and inspection equipment in the semiconductor industry.

Phil Vere, Vice President of Nordson Test and Inspection, said: “Nordson is excited to be the lead test and inspection partner for the H1perChain project. Working within the consortium will give us the opportunity to develop new technologies and products to address the growing EV market.”

About Nordson DAGE 

Headquartered in Aylesbury, UK, Nordson DAGE is a unit of the Nordson Corporation and manufactures and supports a complete range of award-winning digital X-ray inspection systems and bond test equipment for the printed circuit board assembly and semiconductor industries. For more information, visit





Suggested Items

The Convergence: IPC Merging CFX With IPC-2581

09/16/2019 | Andy Shaughnessy, I-Connect007
Gary Carter of XPLM and Michael Ford of Aegis Software are heading a group tasked with combining the IPC-2581 standard, now referred to as Digital Product Model Exchange (DPMX), with IPC’s Connected Factory Exchange (CFX). In this interview, they discuss the benefits that can be expected when these standards are fully merged for both PCB designers and process engineers on the manufacturing floor.

How Digitalization Is Transforming the Electronics Manufacturing Industry

09/11/2019 | Neil Sharp, JJS Manufacturing
The rise of the "digital" supply network—such as the cloud, big data, 3D printing, augmented reality, or the internet of things (IoT)—promises to address issues such as increasing global competition, rising consumer expectations, and the increasingly complex patterns of consumer demand, by providing a greater level of transparency, innovation, and resiliency. And there is a growing belief among business strategists that the more digitalized our manufacturing supply chains can become, the greater our efficiency will be.

eSMART Factory Conference 2019, Day 1

09/02/2019 | Happy Holden, I-Connect007
The recent eSMART Factory Conference in June in Dearborn, Michigan, was the second annual conference on the smart factory. SMTA described it as "A technical conference with a focus on electronics manufacturing from software systems/processes to augmented reality and smart inspection." In this article, Happy Holden gives us the highlights of the conference.

Copyright © 2019 I-Connect007. All rights reserved.