Indium to Exhibit at the Guadalajara Expo & Tech Forum

Reading time ( words)

Indium Corporation will feature its proven suite of solder pastes for reliability at the Guadalajara Expo & Tech Forum, October 23-24 in Verde Valle, Guadalajara.

Indium Corporation’s suite of solder pastes for reliability have a proven track record of eliminating common industry defects and delivering reliability in order to solve the assembly challenges of today and tomorrow. 

Indium Corporation’s solder pastes, including Indium8.9HF, are specially formulated to deliver all-around reliability through ultra low-voiding, plus enhanced benefits such as improved response-to-pause, stability, head-in-pillow minimization, elimination of dendritic growth, non-wet open resistance, and enhanced solder beading performance. Indium8.9HF exceeds all requirements for enhanced electrical reliability. It also provides low voiding on bottom termination components with no dendritic growth. 

About Indium Corporation

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit



Suggested Items

UV-curable Materials and Conformal Coatings

12/23/2019 | Pete Starkey, I-Connect007
Pete Starkey and Phil Kinner, global business and technical director, coatings division, Electrolube, discuss the characteristics and benefits of the company’s new UV-cured conformal coatings. Phil also describes the development of coatings for critical avionics applications and Electrolube’s collaboration with the U.K. National Physical Laboratory to establish a new condensation test.

IPC Electronics Materials Forum 2019

10/16/2019 | IPC
IPC will be holding its Electronics Materials Forum 2019 from November 5–7, 2019, in Bloomington, Minnesota. The Electronics Materials Forum is a new technical conference focused on developments in materials and processes associated with advanced electronics assembly and manufacturing.

Meet Chris Ellis, SMT007 Columnist

09/18/2019 | I-Connect007
Meet Chris Ellis, one of our newest SMT007 columnists! In his columns, Ellis addresses common problems that Manncorp customers have had with the in-house conversion process, and shares solutions that have worked in the past.

Copyright © 2020 I-Connect007. All rights reserved.