SMTA 2019 International Awards

Reading time ( words)

The SMTA International conference—held September 22–29, 2019, at the Stephens Convention Center in Rosemont, Illinois—honored industry members with awards for their contributions to the industry. I-Connect007 has compiled an unofficial list of award recipients. The official list from SMTA will be released shortly, and I-Connect007 will publish it as soon as it is available.

Members of Distinction Award Winners for 2019

Founders Award: Charles E. Bauer, Ph.D., TechLead Corporation

Member of Technical Distinction Award: Dudi Amir, Intel Corporation

Excellence in International Leadership Award: Ivan Romo, SMarTsol Technologies

Excellence in Leadership Award: Greg Kloiber, Ducommun

SMTA+ Corporate Award: Intel Corporation

Grant/Scholarship Winners for 2019 

Hutchins Grant: Benjamin Stewart, Georgia Institute of Technology

Stromberg Scholarship: Kim Porter, Lorain County Community College

2018 SMTA International Conference Award Winners: Rich Freiberger, Best of Conference Presentation

"The Role of Nickel in Solder Alloys, Part 2: The Effect of Ni on The Integrity of The Interfacial Intermetallic in Sn-Based Solder Joints to Copper Substrates," Kazuhiro Nogita, The University of Queensland

Best of Proceedings Paper

First Place: "Alloy Composition and Thermal Fatigue of High-Reliability Pb-Free Solder Alloys," Richard Coyle, Ph. D., Nokia Bell Labs

Second Place: "Dissolution Rate of Specific Elements in SAC305 Solder," David Hillman, Collins Aerospace

Third Place: "The Influence of Printed Circuit Board Thickness on the Thermal Fatigue of Quad Flat No-Lead Packages," Richard Coyle, Ph.D., Nokia Bell Labs

Best Student Paper

"Assessment of Second-Level Interconnect Quality in Flip Chip Ball Grid Array (FCBGA) Package Using Laser Ultrasonic Inspection Technique," Vishnu Reddy, Georgia Institute of Technology



Suggested Items

The iNEMI 2019 Board Assembly Roadmap

06/01/2020 | Pete Starkey, I-Connect007
iNEMI continues to publish chapters of its 2019 Roadmap and recently presented an overview of its Board Assembly Roadmap Chapter in a webinar prefaced by Grace O’Malley, vice president of global operations. The new chapter is just the latest addition to this global effort from 23 working groups contributing expert input from all aspects of the electronics industry.

Joe Fjelstad Breaks Down His Occam Process

03/04/2020 | I-Connect007 Editorial Team
Joe Fjelstad recently met with the I-Connect007 Editorial Team to discuss the potential benefits of his Occam process for solderless assembly. This technique allows assembly of the PCB without the risks associated with traditional surface-mount processes, such as solder joint failure. Has the time come for the industry to embrace Occam?

Stencils: Not As Simple As They Seem

02/26/2020 | I-Connect007 Editorial Team
Stephanie Hardin of Integrated Ideas and Technologies Inc. discusses her role in the supply chain as a stencil manufacturer, improvements she sees from micromachined step stencils, and why she believes trying to have standardized stencil layouts is wishful thinking due to the many fluctuating variables.

Copyright © 2020 I-Connect007. All rights reserved.