Koh Young America and Panasonic Join Forces to Deliver a Technical Workshop at Assembly Products


Reading time ( words)

During a two-day technical workshop in New England, Koh Young America will discuss the important role of solder paste inspection (SPI) to understand and then optimize the solder paste print process to improve printed circuit board assembly production yield. Additionally, Panasonic will discuss how the proven connectivity between its printers and mounters and the Koh Young SPI and Automated Optical Inspection (AOI) equipment will benefit manufacturers with Advanced Process Control (APC). The 2-day Print Process Characterization workshop is scheduled for 23-24 October 2019 at the Westford Regency with live machine demonstrations at the Assembly Products Lab in Chelmsford, MA.

Assembly Products is using two industry-respected engineers from Koh Young and Panasonic to lead the workshop. Mr. Ray Welch is a Sr. Applications Engineer at Koh Young America who focuses on helping customers enhance the effectiveness of their use of SPI to characterize and optimize the paste printing process. “During my sessions, I will present materials that will workshop participants enhance their understanding of SPI,” said Ray. “I want to help manufacturers improve their process by teaching them how to use SPI as a process optimization tool rather than a basic “Go” or “No Go” inspection system.”

Specifically, Ray will demonstrate how manufacturers can use Print Process Characterization to fully optimize their printed circuit board assembly process. For the next phase of the workshop, Assembly Products tapped on Panasonic to discuss mounter connectivity. Doug Africano is a Solutions Engineer in the Process Automation division of Panasonic Systems Solution Company of North America.

He supervises the Panasonic Cloud9 Technology Center in Buffalo Grove, Illinois where he helps showcase total solution offerings from Panasonic and its partners, including Koh Young. In this part of the event, Doug will share details about how the Panasonic Adaptive Process Control (APC) technology, which we have integrated with the Koh Young SPI and AOI systems, can boost production yield and lower manufacturing costs by reducing rework and repair.

To learn more about attending the private event, please visit the Assembly Products website and navigate to the workshop page by visiting https://www.assemblyproducts.us/technology-workshop. If you are unable to join the event in New England, you can still learn more about Koh Young by visiting its website at www.KohYoung.com. Alternatively, visit Koh Young at the i4.0 Connect Forum in Fremont, CA (www.i40connectforum.com), SMTA International in booth 609 (www.SMTA.org/SMTAI), or at SMTA Guadalajara in booth 227 (www.SMTA.org/expos/#guadalajara).

About Koh Young Technology Inc.

Koh Young, the leading 3D measurement-based inspection equipment and solutions provider, performs an essential role for quality control and process optimization across a growing set of industries including printed circuit board assembly, machining and assembly process manufacturing, semiconductor manufacturing, and medical. Beyond its headquarters in Seoul, Koh Young has sales and support offices in Germany, Japan, Singapore, China, Mexico, and the U.S. to ensure a close relationship with its growing customers, while supplying access to a global network of inspection and measurement experts.

Share

Print


Suggested Items

Solder Paste Printing From the Stencil’s Perspective

02/19/2020 | I-Connect007 Editorial Team
Jeff Schake of ASM Assembly Systems discusses the complications surrounding printing and solder paste that he sees from his perspective as a stencil expert.

Blackfox Trains Veterans for Good Manufacturing Jobs

02/18/2020 | Real Time with...IPC
Blackfox Training Institute has been training manufacturing technologists for over 20 years. Based in Longmont, Colorado, Blackfox is now focused on helping veterans of our armed services transition into good jobs in the manufacturing sector. During IPC APEX EXPO 2020, Editor Nolan Johnson spoke with Blackfox CEO Al Dill about the company's veteran training programs, and how this effort is helping companies fill jobs that might otherwise go unfilled.

Solder in PCBA: Can’t Live Without It... or Can We?

02/17/2020 | Joe Fjelstad, Verdant Electronics
For most of its historical use in electronics, the solder alloy of choice was tin-lead, either an Sn60/Pb40 alloy or the Sn63/ Pb37 eutectic version of the tin-lead alloy. These two alloys were the workhorses of the industry. They were both well understood in terms of their processing and reliability—that is, until the advent of lead-free, a well-meaning but ill-conceived and poorly executed conversion, forced on the industry by the European Union in 2006.



Copyright © 2020 I-Connect007. All rights reserved.