Real Time with... SMTAI 2019 Video Interviews

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The SMTA International Conference and Exhibition 2019, which took place September 22–26, 2019, at the Donald E. Stephens Convention Center in Rosemont, Illinois, concluded successfully. For those of you who were not able to make it to the show, catch our video interviews with the movers and shakers of the electronics industry. We've updated our video presentation for a better experience for our users, so check it out!

Below is the list of Real Time with… SMTAI 2019 video interviews at the show. Also, visit Real Time with... SMTAI 2019 to view our expansive photo gallery of images captured throughout the exhibition floor.

1. EPTAC Continues Its Expansion
2. Gary Tanel Provides an SMTA Update
3. Michael Ford on IPC-CFX and the Effects of Industry 4.0
4. SMTAI 2019 Technical Sessions Overview and 2020 Preview
5. Lenora Clark Discusses Company Changes and Her New Role
6. Juan Arango Discusses Koh Young America's New Headquarters
7. SMTAI 2019: Nir Benson Discusses Mentor's Challenges and Solutions
8. Company Updates and Future J-STD-001 Changes
9. Creative Electron's Mobile X-ray Van and LED-specialized Equipment
10. Chris Bastecki on Low-temperature Solder Challenges and Products
11. KIC's New, Smart Factory Products
12. Tom Forsythe on Cleaning Challenges and Solutions
13. MIRTEC's Newest Product Introduced at SMTAI
14. Kristen Mattson on the SMTAI Vacuum Reflow Systems Demo
15. Carmichael Gugliotti Discusses His First SMTAI Paper
16. SAFI-Tech's No-heat SAC305: A Possible Gamechanger
17. George Milad's SMTAI Paper and the IPC ENIG Specification Revision

03/25/2020 | Brent Fischthal, Koh Young America

When we look at the optical inspection market growth trajectory, we can see how process challenges helped create innovations. For example, solder paste inspection (SPI) has undergone a shift from 2D to 3D because the 2D inspection technologies manufacturers traditionally used to collect solder deposit images could not solve shadowing problems. Thus, companies developed 3D SPI to capture the printed solder paste height to accurately measure the total volume of paste printed. Several years later, we see the same need for surface-mounted component inspection with AOI systems.

03/24/2020 | AIM Solder

AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce the appointment of Oscar Hernandez to the position of Sales Manager for the Queretaro and Bajio regions of Mexico.

03/18/2020 | Nolan Johnson, I-Connect007

In my role as a media representative, my perspective on IPC APEX EXPO may be a bit different from that of many attendees. Since the I-Connect007 team had the opportunity to talk to many attendees and exhibitors and listen to their stories over the course of the week, our view can be particularly wide. When I reflected on all the conversations, pieces from all throughout the week coalesced and provided a different understanding of and takeaway from the show.