SMTA Additive Electronics Conference: Industry Trends


Reading time ( words)

In her column, "Flex Talk: Additive Electronics: PCB Scale to IC Scale," Tara Dunn, Omni PCB president and conference co-chair, wrote, "The standard subtractive-etch process serves the industry well. Developments in materials, chemistry, and equipment enable the traditional PCB fabrication process to achieve feature sizes, such as line and space down to 30 microns. Larger shops with more sophisticated capabilities are building this technology today."

Tara continued, "Mainstream PCB manufacturing is often limited to 50-75 microns (mm) line and space. But the electronics industry is evolving quickly. Propelled by the demand for more sophisticated electronics, PCB design is being tasked with finer lines, thinner materials, and smaller via sizes. A traditional progression is to first move to HDI technology with microvias and multiple lamination cycles for fabrication. Today’s mSAP and SAP technology offers an advanced approach, with line and space capabilities of less than 25 microns, to meet these exceedingly complex design requirements." Tara will also be attending and moderating a panel discussion at the conference.

Don't miss out; start your research. Attend the SMTA Additive Electronics Conference on October 24, 2019, to launch your expertise in additive electronics.

Share

Print


Suggested Items

Just Ask Happy: The Future of 3D Printing

06/30/2020 | I-Connect007 Editorial Team
We asked for you to send in your questions for Happy Holden, and you took us up on it! The questions you've posed run the gamut, covering technology, the worldwide fab market, and everything in between. Enjoy.

Just Ask Happy: The Future of Mechanical Blind, Buried Vias

06/26/2020 | I-Connect007 Editorial Team
We asked for you to send in your questions for Happy Holden, and you took us up on it! The questions you've posed run the gamut, covering technology, the worldwide fab market, and everything in between. Enjoy.

The iNEMI 2019 Roadmap: Flexible Hybrid Electronics

06/04/2020 | Pete Starkey, I-Connect007
The emerging trend for “electronics on everything, everything with electronics” was the theme of iNEMI’s webinar presentation of the highlights of its recently published Flexible Hybrid Electronics Roadmap Chapter, delivered by Girish Wable, senior engineering services manager with Jabil. Pete Starkey provides an overview.



Copyright © 2020 I-Connect007. All rights reserved.