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The 16th Annual International Wafer-Level Packaging Conference (IWLPC), which brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing, will be held on October 22–24, 2019 in San Jose, California, USA.
Interconnecting wafer-level packaging, 3D packaging, and advanced manufacturing and test, the IWLPC is at the forefront of the packaging technology evolution.
The Wafer-Level Packaging (WLP) track features sessions on advanced wafer level packaging and materials, reliability and metrology, fan out wafer level packaging (FO-WLP), and advanced processing.
The 3D Packaging track features sessions on design, characterization and test, wafer bonding and chip stacking, and processing for fan-out.
The Advanced Manufacturing track features sessions on process materials and equipment.
To register for the IWLPC, click here: https://www.iwlpc.com/register_now.cfm.
Mark Laing, Siemens Digital Industries Software
For PCB and assembly manufacturers, test engineering has become a critical factor in enhancing the profitability of new product introductions (NPIs). Given the trend toward high-mix, low-volume production, the journey from design data to an automated PCB testing program must be quicker and more efficient than ever before. In this article, we will discuss how to optimize the efficiency of the test engineering process in accordance with these new market realities.
Andy Shaughnessy, I-Connect007
At SMTA Dallas, Andy Shaughnessy stopped by the booth for The Test Connection, to find out from Bert Horner why the company has evolved into spending more time educating and consulting with their customers when it comes to testing new designs.
Tracy Riggan, IPC
A significant number of automotive activities made notable strides at this year’s IPC APEX EXPO. Several committees dedicated to creating and updating automotive addenda for existing IPC standards, like assembly processes, PCB fabrication, and high-voltage cable, met and were led by companies like Toyota, Bosch, Continental, and Elmatica. Automotive dedicated groups, like the Cold Joining/Press-fit Task Group, also met and discussed inclusions in its next planned revision.