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TopLine’s CCGA column grid array IC packages and large ball grid array (BGA) package solutions will highlight the company’s exhibit at productronica 2019. TopLine will exhibit in Hall A3 Booth 102, in the USA Pavilion.
In making the announcement, Martin Hart, President, stated, “We’re reaching out especially to international customers at the show to introduce them to these enabling technologies. In fact, we’ve been continuously active in promoting our products in the global market for almost 30 years. We’re especially excited about the benefits of CCGAs, as well as our large BGA package solutions.”
TopLine’s CCGA column grid array IC packages are made with non-collapsible solder columns for surface mount soldering on printed circuit boards (PCBs) and provide more compliancy than solder balls (ball grid arrays or BGAs) to absorb stress and increase solder joint reliability under harsh operating conditions.
Hart states that “Currently, the largest field orogrammable gate array (FPGA) BGAs are 45mm x 45mm in size. But there is a movement trending to produce larger BGAs such as 50mm x 50mm and even 60mm x 60mm. But the ‘super-sized’ BGAs of 70x70mm to 100x100mm exhibit additional stress, resulting in warpage and other difficulties.” Hart adds that “Industry leading suppliers of semiconductor and infrastructure software products, such as Intel, Huawei, Broadcom, and others, are beginning to produce ‘super giant’ BGA packages with multiple die inside that have accompanying stability issues. At TopLine, we maintain that these larger BGAs can benefit by using solder column technology instead of BGA solder balls. This is our solution to stress-related stability issues. We’ll be talking about and showing our solution in Hall A3 Booth 102, in the USA Pavilion.”
TopLine manufactures a wide range of daisy chain semiconductor packages for process development, experimentation, machine evaluation, solder training, and SMT assembly practice. TopLine products provide hands-on learning for engineers.