TopLine CCGA, Large BGA Solutions to Highlight Exhibit at productronica


Reading time ( words)

TopLine’s CCGA column grid array IC packages and large ball grid array (BGA) package solutions will highlight the company’s exhibit at productronica 2019. TopLine will exhibit in Hall A3 Booth 102, in the USA Pavilion.

In making the announcement, Martin Hart, President, stated, “We’re reaching out especially to international customers at the show to introduce them to these enabling technologies. In fact, we’ve been continuously active in promoting our products in the global market for almost 30 years. We’re especially excited about the benefits of CCGAs, as well as our large BGA package solutions.”

TopLine’s CCGA column grid array IC packages are made with non-collapsible solder columns for surface mount soldering on printed circuit boards (PCBs) and provide more compliancy than solder balls (ball grid arrays or BGAs) to absorb stress and increase solder joint reliability under harsh operating conditions.

Hart states that “Currently, the largest field orogrammable gate array (FPGA) BGAs are 45mm x 45mm in size. But there is a movement trending to produce larger BGAs such as 50mm x 50mm and even 60mm x 60mm. But the ‘super-sized’ BGAs of 70x70mm to 100x100mm exhibit additional stress, resulting in warpage and other difficulties.” Hart adds that “Industry leading suppliers of semiconductor and infrastructure software products, such as Intel, Huawei, Broadcom, and others, are beginning to produce ‘super giant’ BGA packages with multiple die inside that have accompanying stability issues. At TopLine, we maintain that these larger BGAs can benefit by using solder column technology instead of BGA solder balls. This is our solution to stress-related stability issues. We’ll be talking about and showing our solution in Hall A3 Booth 102, in the USA Pavilion.”

About TopLine

TopLine manufactures a wide range of daisy chain semiconductor packages for process development, experimentation, machine evaluation, solder training, and SMT assembly practice. TopLine products provide hands-on learning for engineers.

Share

Print


Suggested Items

Solder Paste Printing From the Stencil’s Perspective

02/19/2020 | I-Connect007 Editorial Team
Jeff Schake of ASM Assembly Systems discusses the complications surrounding printing and solder paste that he sees from his perspective as a stencil expert.

Blackfox Trains Veterans for Good Manufacturing Jobs

02/18/2020 | Real Time with...IPC
Blackfox Training Institute has been training manufacturing technologists for over 20 years. Based in Longmont, Colorado, Blackfox is now focused on helping veterans of our armed services transition into good jobs in the manufacturing sector. During IPC APEX EXPO 2020, Editor Nolan Johnson spoke with Blackfox CEO Al Dill about the company's veteran training programs, and how this effort is helping companies fill jobs that might otherwise go unfilled.

Solder in PCBA: Can’t Live Without It... or Can We?

02/17/2020 | Joe Fjelstad, Verdant Electronics
For most of its historical use in electronics, the solder alloy of choice was tin-lead, either an Sn60/Pb40 alloy or the Sn63/ Pb37 eutectic version of the tin-lead alloy. These two alloys were the workhorses of the industry. They were both well understood in terms of their processing and reliability—that is, until the advent of lead-free, a well-meaning but ill-conceived and poorly executed conversion, forced on the industry by the European Union in 2006.



Copyright © 2020 I-Connect007. All rights reserved.