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A new technical paper that focuses on the application requirements of printing small apertures and the results of a design of experiment testing will be presented at the upcoming productronica trade fair in Germany. The paper will be presented by Edward Nauss, MPM Applications Engineer at ITW EAE.
Component miniaturization with packages requiring 0201 metric resistors and capacitors presents specific challenges to solder printing process. To address these challenges MPM’s engineers examined each aspect of the printing process. This included essential machine requirements including correct squeegee blades, tooling support and required calibrations to meet the demanding specifications. The correct match and design of materials will be addressed focusing on the stencil and substrate design along with solder paste and cleaning solvent requirements.
“We will be presenting the results of a design of experiment and explain the printer and Solder Paste Inspection setup and specific machine parameters used,” said Edward Nauss, MPM applications engineer. “We were very satisfied with our results and are looking forward to sharing our research.
About ITW EAE
ITW EAE, a division of Illinois Tool Works, Inc., is the global leader in process knowledge, services and manufacture of capital equipment used in the printed circuit board assembly and semiconductor industries. The group brings together the world’s leading brands of electronics assembly equipment: MPM Printers, Camalot Dispensers, Electrovert Cleaners and Soldering Solutions, Vitronics Soltec Soldering Solutions and Despatch Thermal Processing Technology. For more information visit www.itweae.com.