MPM to Present Technical Paper on Stencil Printing 0201 metric Apertures at productronica

Reading time ( words)

A new technical paper that focuses on the application requirements of printing small apertures and the results of a design of experiment testing will be presented at the upcoming productronica trade fair in Germany. The paper will be presented by Edward Nauss, MPM Applications Engineer at ITW EAE.

Component miniaturization with packages requiring 0201 metric resistors and capacitors presents specific challenges to solder printing process. To address these challenges MPM’s engineers examined each aspect of the printing process. This included essential machine requirements including correct squeegee blades, tooling support and required calibrations to meet the demanding specifications. The correct match and design of materials will be addressed focusing on the stencil and substrate design along with solder paste and cleaning solvent requirements.

“We will be presenting the results of a design of experiment and explain the printer and Solder Paste Inspection setup and specific machine parameters used,” said Edward Nauss, MPM applications engineer. “We were very satisfied with our results and are looking forward to sharing our research.


ITW EAE, a division of Illinois Tool Works, Inc., is the global leader in process knowledge, services and manufacture of capital equipment used in the printed circuit board assembly and semiconductor industries. The group brings together the world’s leading brands of electronics assembly equipment: MPM Printers, Camalot Dispensers, Electrovert Cleaners and Soldering Solutions, Vitronics Soltec Soldering Solutions and Despatch Thermal Processing Technology. For more information visit



Suggested Items

Meet Zulki Khan, SMT007 Columnist

10/25/2019 | I-Connect007
Meet Zulki Khan, one of our newest SMT007 columnists! Khan’s columns address new frontiers in upcoming manufacturing techniques, including challenges in the marriage of SMT and microelectronics manufacturing and the critical aspects involved.

The Convergence: IPC Merging CFX With IPC-2581

09/16/2019 | Andy Shaughnessy, I-Connect007
Gary Carter of XPLM and Michael Ford of Aegis Software are heading a group tasked with combining the IPC-2581 standard, now referred to as Digital Product Model Exchange (DPMX), with IPC’s Connected Factory Exchange (CFX). In this interview, they discuss the benefits that can be expected when these standards are fully merged for both PCB designers and process engineers on the manufacturing floor.

PCB Design Training: More Critical Than Ever

09/05/2019 | Andy Shaughnessy, Design007 Magazine
I interviewed Gary Ferrari of FTG at the IPC High-Reliability Forum and Microvia Summit in Baltimore. Gary is a co-founder of the IPC Designers Council and a longtime advocate for PCB design and PCB designers. We discussed the crucial role that PCB designers play in the entire electronics development process, and how IPC and the Designers Council are helping to educate and inform the next generation of designers.

Copyright © 2019 I-Connect007. All rights reserved.