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When I-Connect007 asked Tara Dunn, Omni PCB president and conference co-chair, about the types of applications discussing or adopting additive PCB technology, she replied, "Applications that need extremely thin copper, are concerned with space and weight, and have complex pin-outs, pushing the capabilities of traditional PCB manufacturing, could utilize SAP or mSAP technology. If you’re not using this kind of technology now, the chances are good that you will be soon."
Tara will also be attending and moderating a panel discussion at the conference.
Don’t miss out; start your research. Attend the SMTA Additive Electronics Conference on October 24, 2019, to launch your expertise in additive electronics.